60-MHz Wine-Glass Micromechanical-Disk Reference Oscillator

ISSCC 2004 / SESSION 17 / MEMS AND SENSORS / 17.7 Y.-W. Lin, S. Lee, S.-S. Li, Y. Xie, Z. Ren, and C. T.-C. Nguyen, “60-MHz wine glass micromechanical disk reference oscillator,” Digest of Technical Papers, 2004 IEEE International Solid-State Circuits Conference, San Francisco, California, Feb. 15-19, 2004, pp. 322-323.

17.7

60-MHz Wine-Glass Micromechanical-Disk Reference Oscillator

Yu-Wei Lin, Seungbae Lee, Sheng-Shian Li, Yuan Xie, Zeying Ren, Clark T.-C. Nguyen University of Michigan, Ann Arbor, MI The quartz crystal used in the reference oscillator in a wireless communication transceiver is among the most difficult to integrate on chip. On-chip devices capable of matching its Q (on the order of 10,000) and temperature stability (G%@

Figure 17.7.3: Detailed circuit schematic of the sustaining transresistance amplifier of this work, implemented by a fully-differential amplifier in a shunt-shunt feedback configuration.

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Figure 17.7.6: Scanning electron micrograph (SEM) of a fabricated wine glass disk resonator with two supports, with its measured frequency characteristic.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.7: Phase noise density versus carrier offset frequency plot for the micromechanical resonator oscillator of Figure 17.7.4, measured by an HP E5500 Phase Noise Measurement System.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.1: Perspective-view schematic of the micromechanical wine-glass-mode disk resonator in a typical two-port bias and excitation configuration with an equivalent LCR circuit model.

• 2004 IEEE International Solid-State Circuits Conference

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Figure 17.7.2: Mode shape for the wine-glass-mode disk resonator of Fig. 17.7.1 simulated via finite element analysis (ANSYS).

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.3: Detailed circuit schematic of the sustaining transresistance amplifier of this work, implemented by a fully-differential amplifier in a shunt-shunt feedback configuration.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.4: Top-level circuit schematic of the micromechanical resonator oscillator of this work. Here, the micromechanical resonator is represented by its equivalent electrical circuit.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.5: Photo of the sustaining transresistance amplifier fabricated in TSMC’s 0.35µm CMOS process.

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• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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Figure 17.7.6: Scanning electron micrograph (SEM) of a fabricated wine glass disk resonator with two supports, with its measured frequency characteristic.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE



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2IIVHW)UHTXHQF\>+]@ Figure 17.7.7: Phase noise density versus carrier offset frequency plot for the micromechanical resonator oscillator of Figure 17.7.4, measured by an HP E5500 Phase Noise Measurement System.

• 2004 IEEE International Solid-State Circuits Conference

0-7803-8267-6/04 ©2004 IEEE

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