cystech Etectronics Gorp.

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Spec. No. : C589N3 lssued Date : 2010.11.09 Revised Date : 2013.04.17 Page No. : 9/ 9

cystech Etectronics Gorp.

SOT-23 Dimension

Marking:

Device

3-Lead SOT-23 Plastic Surface Mounted Package CYStek Package Code: N3

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lnches Millimeters Min. Max. Mjn"== :Nhx. 0.1102 0"1204 Cz.eo 3"04 0.0472 0.0669 1.20 0.0335 0.0512 0-39-- 1.30 0.0118 0.0197 0.30 0.50 0.0669 0.0910 1.70 2.30 0.0000 0.0040 0.00 0.10

DIM

A B

C D G H

Style: Pin 1.Gate 2.Source 3.Drain

lnches Max. 0.0032 0.0079 0.0118 0.0266 0.0335 0.0453 0.0830 0.1161 0.0098 0.0256

DIM

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tt

K

Millimeters Max. 0.08 0.20 0.30 0.67 0.85 1.15 2.10 2.95-)] 026 0.65

Min.

L

S

V

Min.

Notes: l.Controlling dimension: millimeters. 2.Maximum lead thickness includes lead flnish thickness, and minimum lead thickness is the minimum thickness of base material. 3.lf there is any question with packing specification or packing method, please contact your local CYStek sales office.

Material:

.

Lead: Pure tin

plated.

o Mold Compound: Epoxy resin family, flammability solid burning class:

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UL94V-

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lmportant Notice: . All rights are reserved. Reproduction in whole or in part is prohibited without t

. .

CYStek reserves the right to make changes to its products without notice. CYStek semiconductor products are not warranted to be suitable for us< o CYStek assumes no liability for any consequence of customer product design

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Philips Semiconductors

Product specification

Voltage regulator double diodes

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Plastic surface mounted package; 3

PZM-NA series

leads

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1.7 1.3

1.9

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3.0 2.5

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0.33 0.23

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DIMENSIONS (mm are the original dimensions) UNIT

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soT346

1999 Jun

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REFERENCES

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JEDEC TO-236

EIAJ SC.59

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