/B and /R Flows

/B and /R Flows /B: Devices are processed to MIL STD 883 for class B devices which includes screening to test method 5004 including burn-in and 100% electrical testing across the full operating temperature range and QCI per test method 5005 (Groups A, B, C and D). Processing to MIL-STD-883 would be performed, but devices are non-compliant. /R: Devices are processed to MIL STD 883 test method 5004 screening including burn in. Processing includes 5004 screening and Group A sample. (/R devices do not receive QCI for groups B, C and D.

START WAFER/DIE QA INSPECT

TEMPERATURE CYCLING

ASSEMBLY HOUSE INCOMING QA INSPECT

CONSTANT ACCELERATION LEAD TRIM (if applicable)

WAFER SAW and DIE PREP SECOND OPTICAL INSPECTION QA LOT ACCEPTANCE FRAME ATTACH (if applicable)

LEAD FINISH and INSPECTION MARK and CURE (optional sequence) FINE LEAK SEAL TEST GROSS LEAK SEAL TEST

DIE ATTACH DIE ATTACH CURE

VISUAL EXTERNAL INSPECTION

WIRE BOND

QA LOT ACCEPTANCE

THIRD OPTICAL INSPECTION

INCOMING QA LOT ACCEPTANCE

QA LOT ACCEPTANCE Rochester FIELD SOURCE SURVEILLANCE LOT ACCEPTANCE (optional) PRE-SEAL BAKE and VACUUM PRE-WELD BAKE (TO package styles) HERMETIC SEAL / WELD

www.rocelec.com

Test INCOMING INSPECTION INITIAL ELECTRICAL TEST BURN IN ELECTRICAL TEST AT ALL TEMPERATURES QUALITY CONFORMANCE INSPECTION Group A EXTERNAL VISUAL QUALITY CONFORMANCE INSPECTION (/B only) Groups B, C, and D

FINAL QA LOT ACCEPTANCE

FINISH

© 2016 Rochester Electronics, LLC Worldwide Corporate Headquarters 16 Malcolm Hoyt Drive Newburyport, MA 01950 USA phone: 978.462.9332 fax: 978.462.9512 email: [email protected]

The Semiconductor Lifecycle Solution™ 100% AUTHORIZED and licensed by over 70 leading semiconductor manufacturers

Inventory Distribution

www.rocelec.com

Product Manufacturing

Manufacturing Services