70 Fig. 1 Fig. 2 Ordering Information Fig. 3 Fig. 4 Fig. 5 - Upverter

INTERCONNECTS .050” Grid Single and Double Row (Number of Pins X .050”) + .015”

Series 850, 851 852, 853

• Series 850 single and double row interconnects have .050” pin spacing and permit board stacking as low as .248”. • Pin headers have .016” dia. pins. (MM# 4006-0 see page 166 for details). • MM# 4890-0 and 0467 receptacles use M-M#11 Hi-Rel, 3-finger beryllium copper contacts rated at 3 amps. (#11 contact accepts pin diameters from .015-.020)

Fig. 1 (Number of Pins X .050”/2) + .015”

• Insulators are high temp. thermoplastic, suitable for all soldering operations.

Ordering Information Single Row

Fig. 1

.087” Profile Pin Header 850-XX-0_ _-10-001000

Specify # of pins Fig. 2

Double Row (Number of Pins X .050”) + .015”

01-50 .075” Profile Pin Header

852-XX-_ _ _-10-001000

Fig. 2

Specify # of pins XX= Plating Code See Below

2O(3

%#

10

SPECIFY PLATING CODE XX=

Fig. 3

10μ” Au

Pin Plating

Single Row

(Number of Pins X .050”/2) + .015”

002-100

Fig. 3

90

40

200μ” Sn/Pb

200μ” Sn

.161” Profile Socket 851-XX-0_ _-10-001000

Specify # of pins

Fig. 4

01-50

Double Row .161” Profile Socket 853-XX-_ _ _-10-001000 Specify # of pins

Fig. 4

Single Row (Number of Pins X .050”) + .040”

Fig. 5

002-100 .185” Profile Socket

851-XX-0_ _-10-002000 Specify # of pins XX= Plating Code See Below

2O(3

%#

SPECIFY PLATING CODE XX=

Fig. 5

w w w. m i l l - m a x . c o m

01-77

13 

Sleeve (Pin)

10µ” Au

Contact (Clip)

30µ” Au

70

91

93

41 

99

43 

44 

200µ” Sn/Pb 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn 200µ”Sn 10µ” Au

30µ” Au

200µ”Sn/Pb

10µ” Au

30µ” Au 200µ”Sn

 516-922-6000