MEC8–140–02–L–D–EM2
F-218
MEC8–160–02–L–D–EM2
MEC8–140–02–L–D–RA1 MEC8–110–02–L–D–RA1
(0.80 mm) .0315"
MEC8-RA, MEC8-EM SERIES
RIGHT-ANGLE/EDGE MOUNT SOCKETS Mates with: (1.60 mm) .062" thick card
SPECIFICATIONS For complete specifications and recommended PCB layouts see www.samtec.com?MEC8-RA
POSITIONS PER ROW
1
MEC8 Note: Some sizes, styles and options are non-standard, non-returnable.
Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C Insertion Depth: (3.94 mm) .155" to (6.25 mm) .246" Current Rating: 2.4 A per pin (2 adjacent pins powered) Voltage Rating: 265 VAC RoHS Compliant: Yes Lead–Free Solderable: Yes
POS. PER ROW 13 25 37 40 49
RECOGNITIONS
50
For complete scope of recognitions see www.samtec.com/quality
A
PLATING OPTION
02
10, 13, 20, 25, 30, 37, 40, 49, 50
B
02
(15.00) (6.10) .591 .240 (24.60) .969 (18.10) (34.20) .713 1.346 (18.90) (36.60) .744 1.441 (43.80) (22.90) 1.724 .902 (44.60) 1.756
HIGH-SPEED CHANNEL PERFORMANCE
ALSO AVAILABLE
(1.80) .071
B
A
(MOQ Required)
(5.77) .227 (2.65) .104 (2.00) .0787 (4.00) .157
(1.40) .055 DIA
(3.53) .139 (0.95) .037 (9.10) .358
POSITIONS PER ROW
1
10, 20, 30, 40, 50, 60, 70
(1.80) .071
RECOGNITIONS
EM2 EM2
= (1.60 mm) .062" thick PCB
= 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
HIGH-SPEED CHANNEL PERFORMANCE
B
A
D
–L
No. of Positions x (0.80) .0315 + (7.80) .307 02
• 1 mm mating card
thickness option • Latching option (1.05) • Elevated .041 Contact Samtec.
PLATING OPTION
02
For complete specifications and recommended PCB layouts see www.samtec.com?MEC8-EM Insulator Material: Black LCP Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Operating Temp Range: -55 °C to +125 °C Insertion Depth: (4.32 mm) .170" to (5.66 mm) .223" Current Rating: 2.2 A per pin (2 adjacent pins powered) Voltage Rating: 265 VAC RoHS Compliant: Yes Lead–Free Solderable: Yes
G b p s
(0.80) .0315 No. of Positions x (0.80) .0315 + (6.20) .244
MEC8
14
MEC8-RA Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact
[email protected] FILE NO. E111594
SPECIFICATIONS
–TR
= Tape & Reel Packaging
= 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
(7.40) .291
(0.90) x (1.40) .035 .055 DIA
Mates with: (1.60 mm) .062" thick card
OTHER OPTION
RA1
–L
No. of Positions x (0.80) .0315 + (3.00) .118
01
D
MEC8-EM Rating based on Samtec reference channel. For full SI performance data visit Samtec.com or contact
[email protected] 01
POSITIONS PER ROW 40 50 60 70
(2.00) .0787
(4.00) .157 (7.00) .276 No. of Positions x (0.80) .0315 + (4.60) .181
For complete scope of recognitions see www.samtec.com/quality
(8.50) .335
14 G b p s
A
B
(18.90) .744
(36.60) 1.441
(22.90) .902
(44.60) 1.756
(26.90) 1.059
(52.60) 2.071
(30.90) 1.217
(60.60) 2.386
ALSO AVAILABLE FILE NO. E111594
Note: Some sizes, styles and options are non-standard, non-returnable.
(5.00) .197
(MOQ Required)
(0.80) .0315
(1.48) .058
• 1 mm mating card thickness option Contact Samtec.
Due to technical progress, all designs, specifications and components are subject to change without notice.
WWW.SAMTEC.COM
All parts within this catalog are built to Samtec’s specifications. Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.