Fast Recovery Diodes (Stud Version), 200 A SD203N/R Series - Vishay

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SD203N/R Series Vishay Semiconductors

Fast Recovery Diodes (Stud Version), 200 A FEATURES • High power fast recovery diode series • 1.0 to 2.0 µs recovery time

RoHS

• High voltage ratings up to 2500 V

COMPLIANT

• High current capability • Optimized turn-on and turn-off characteristics • Low forward recovery • Fast and soft reverse recovery DO-205AB (DO-9)

• Compression bonded encapsulation • Stud version JEDEC DO-205AB (DO-9) • Maximum junction temperature 125 °C • RoHS compliant • Lead (Pb)-free • Designed and qualified for industrial level

PRODUCT SUMMARY IF(AV)

200 A

TYPICAL APPLICATIONS • Snubber diode for GTO • High voltage freewheeling diode • Fast recovery rectifier applications

MAJOR RATINGS AND CHARACTERISTICS PARAMETER IF(AV)

TEST CONDITIONS

TC

IF(RMS) IFSM

I2 t VRRM trr TJ

Document Number: 93170 Revision: 08-Apr-08

VALUES

UNITS

200

A

85

°C

314 50 Hz

4990

60 Hz

5230

50 Hz

125

60 Hz

114

Range

400 to 2500

V

Range

1.0 to 2.0

µs

TJ

A

kA2s

25 °C - 40 to 125

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SD203N/R Series Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors ELECTRICAL SPECIFICATIONS VOLTAGE RATINGS TYPE NUMBER

VOLTAGE CODE

VRRM, MAXIMUM REPETITIVE PEAK AND OFF-STATE VOLTAGE V

VRSM, MAXIMUM NON-REPETITIVE PEAK VOLTAGE V

04

400

500

08

800

900

10

1000

1100

12

1200

1300

14

1400

1500

16

1600

1700

20

2000

2100

25

2500

2600

SD203N/R..S10

SD203N/R..S15

SD203N/R..S20

IRRM MAXIMUM TJ = 125 °C mA

35

FORWARD CONDUCTION PARAMETER

SYMBOL

Maximum average forward current at case temperature Maximum RMS current

Maximum peak, one-cycle non-repetitive forward current

IF(AV) IF(RMS)

IFSM

TEST CONDITIONS 180° conduction, half sine wave

314

t = 10 ms

t = 8.3 ms t = 10 ms

Maximum

for fusing

I2t

No voltage reapplied 100 % VRRM reapplied No voltage reapplied

5230

Sinusoidal half wave, initial TJ = TJ maximum

4400 125 114 88

t = 0.1 to 10 ms, no voltage reapplied

1250

VF(TO)1

(16.7 % x  x IF(AV) < I <  x IF(AV)), TJ = TJ maximum

1.00

High level value of threshold voltage

VF(TO)2

(I >  x IF(AV)), TJ = TJ maximum

1.47

Low level value of forward slope resistance

rf1

(16.7 % x  x IF(AV) < I <  x IF(AV)), TJ = TJ maximum

1.10

High level value of forward slope resistance

rf2

(I >  x IF(AV)), TJ = TJ maximum

0.46

Ipk = 628 A, TJ = 25 °C, tp = 400 µs square pulse

1.65

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VFM

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kA2s

81

Low level value of threshold voltage

Maximum forward voltage drop

A

4200

100 % VRRM reapplied

t = 8.3 ms I2t

°C

4990

t = 10 ms I2t

A

85

t = 10 ms t = 8.3 ms

UNITS

200

DC at 76 °C case temperature

t = 8.3 ms

Maximum I2t for fusing

VALUES

kA2s V

m

V

Document Number: 93170 Revision: 08-Apr-08

SD203N/R Series Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors

RECOVERY CHARACTERISTICS MAXIMUM VALUE AT TJ = 25 °C CODE

Ipk SQUARE PULSE (A)

trr AT 25 % IRRM ( s)

S10

1.0

S15

1.5

S20

2.0

TYPICAL VALUES AT TJ = 125 °C

TEST CONDITIONS

dI/dt (A/ s)

750

25

Vr (V)

trr AT 25 % IRRM ( s)

Qrr ( C)

Irr (A)

2.4

52

33

2.9

90

44

3.2

107

46

- 30

IFM

trr t

dir dt

Qrr IRM(REC)

THERMAL AND MECHANICAL SPECIFICATIONS PARAMETER

SYMBOL

Maximum operating temperature range

TEST CONDITIONS

VALUES

TJ

- 40 to 125

Maximum storage temperature range

TStg

- 40 to 150

Maximum thermal resistance, junction to case

RthJC

DC operation

0.115

Maximum thermal resistance, case to heatsink

RthCS

Mounting surface, smooth, flat and greased

0.08

UNITS °C

K/W

Not-lubricated threads

Mounting torque ± 10 %

31

Lubricated threads

Nm

24.5

Approximate weight

250

Case style

See dimensions (link at the end of datasheet)

g

DO-205AB (DO-9)

RthJC CONDUCTION CONDUCTION ANGLE

SINUSOIDAL CONDUCTION

RECTANGULAR CONDUCTION

180°

0.010

0.008

120°

0.013

0.014

90°

0.017

0.019

60°

0.025

0.027

30°

0.044

0.044

TEST CONDITIONS

UNITS

TJ = TJ maximum

K/W

Note • The table above shows the increment of thermal resistance RthJC when devices operate at different conduction angles than DC

Document Number: 93170 Revision: 08-Apr-08

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SD203N/R Series

Maximum Allowable Case Temperature (°C)

130

SD203N/ RSeries RthJC (DC) = 0.115 K/ W

120 110

Conduction Angle

100 30°

90

60° 90° 120°

80

180° 70 0

40

80

120

160

200

Maximum Average Forward Power Loss (W)

Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors

550 500

400 350 300 250

200 RMS Limit 100

0 0

Conduction Period

100 90

30° 60° 90° 120°

80

180°

DC

70 0

50

100

150

200

250

300

Maximum Average Forward Power Loss (W)

350 180° 120° 90° 60° 30°

250 200

RMS Limit

150 Conduction Angle

100

SD203N/ R Series TJ = 125°C

50 0 0

50

100

150

200

Average Forward Current (A) Fig. 3 - Forward Power Loss Characteristics

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5000

100

150

200

250

300

350

At Any Rated Load Condition And With Rated VRRM Applied Following Surge. Initial TJ = 125°C @60 Hz 0.0083 s @50 Hz 0.0100 s

4500 4000 3500 3000 2500 2000

SD203N/ R Series

1500 1000

350

Average Forward Current (A) Fig. 2 - Current Ratings Characteristics

300

Peak Half Sine Wave Forward Current (A)

110

50

Average Forward Current (A) Fig. 4 - Forward Power Loss Characteristics

1

10

100

Number Of Equal Amplitude Half Cycle Current Pulses (N)

Fig. 5 - Maximum Non-Repetitive Surge Current

Peak Half Sine Wave Forward Current (A)

Maximum Allowable Case Temperature (°C)

120

SD203N/ R Series TJ = 125°C

50

Average Forward Current (A) Fig. 1 - Current Ratings Characteristics

SD203N/ R Series RthJC (DC) = 0.115 K/ W

Conduction Period

150

240

130

DC 180° 120° 90° 60° 30°

450

5500 5000 4500 4000

Maximum Non Repetitive Surge Current Versus Pulse Train Duration. Initial TJ = 125 °C No Voltage Reapplied Rated VRRM Reapplied

3500 3000 2500 2000 1500

SD203N/ R Series

1000 0.01

0.1

1

Pulse Train Duration (s)

Fig. 6 - Maximum Non-Repetitive Surge Current

For technical questions, contact: [email protected]

Document Number: 93170 Revision: 08-Apr-08

SD203N/R Series Fast Recovery Diodes (Stud Version), 200 A (K/ W)

1 Steady State Value: R thJC = 0.115 K/ W (DC Operation)

thJC

TJ= 25 °C TJ= 125 °C

Transient Thermal Impedance Z

Instantaneous Forward Current (A)

10000

Vishay Semiconductors

1000

SD203N/ R Series

100 .5

2.5

4.5

6.5

0.1

0.01 SD203N/ R Series

0.001 0.001

Instantaneous Forward Voltage (V)

0.01

0.1

1

10

Square Wave Pulse Duration (s) Fig. 8 - Thermal Impedance ZthJC Characteristic

Fig. 7 - Forward Voltage Drop Characteristics

120 V

FP

Forwa rd Recovery (V)

100

TJ = 125°C

I

80 60 TJ = 25°C 40 SD203N/ R..S20 Series

20 0 0

200

400

600

800

1000

1200

1400

1600

1800

2000

2.8 2.6 2.4

SD203N/ R..S10 Series TJ = 125 °C, V r = 30V I FM = 750 A Square Pulse

2.2 2

400 A

1.8 200 A

1.6 10

100

Rate Of Fall Of Forward Current - di/ dt (A/µs)

Fig. 10 - Recovery Time Characteristics

Document Number: 93170 Revision: 08-Apr-08

Maximum Reverse Recovery Charge - Qrr (µC)

Maximum Reverse Recovery Time - Trr (µs)

Rate Off Fall Of Forward Current di/ dt (A/ usec) Fig. 9 - Typical Forward Recovery Characteristics

140 I FM = 750 A

130

Square Pulse

120 110 100

400 A

90 80 200 A

70 60 50 40

SD203N/ R..S10 Series TJ= 125 °C, V r = 30V

30 20 10 0

20

40

60

80

100

Rate Of Fall Of Forward Current - di/ dt (A/ µs)

Fig. 11 - Recovery Charge Characteristics

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SD203N/R Series

Maximum Reverse Rec overy Current - Irr (A)

100 I FM = 750 A

90

Square Pulse 400 A

80 200 A

70 60 50 40 30

SD203N/ R..S10 Series TJ = 125 °C, V r = 30V

20 20 30 40 50 60 70 80 90 100

Rate Of Fall Of Forward Current - di/ dt (A/ µs)

Fig. 12 - Recovery Current Characteristics

SD203N/ R..S15 Series TJ = 125 °C, V r = 30V 3.2 I FM = 750 A

2.8

Sq uare Pulse

2.4 400 A

2 200 A

1.6 10

I FM = 750 A Squa re Pulse

150 140 130 120

400 A

110 100

200 A

90 80 70 60

SD203N/ R..S15 Series TJ= 125 °C, V r = 30V

50 10 20 30 40 50 60 70 80 90 100

Rate Of Fall Of Forward Current - di/ dt (A/µs)

Fig. 14 - Recovery Charge Characteristics www.vishay.com 6

100 90

400 A

80 70

200 A

60 50 40 30 20

SD203N/ R..S15 Series TJ= 125 °C, Vr = 30V

10 10 20 30 40 50 60 70 80 90 100

3.6 3.4

SD203N/ R..S20 Series TJ= 125 °C, V r = 30V I FM = 750 A

3.2

Square Pulse

3 2.8

400 A 200 A

2.6 2.4 10

100

Fig. 16 - Recovery Time Characteristics

Maximum Reverse Recovery Charge - Qrr (µC)

Maximum Reverse Recovery Charge - Qrr (µC)

160

Square Pulse

110

Rate Of Fall Of Forward Current - di/d t (A/ µs)

Fig. 13 - Recovery Time Characteristics

170

I FM = 750 A

120

Fig. 15 - Recovery Current Characteristics

100

Rate Of Fa ll Of Forward Current - di/ dt (A/ µs)

130

Rate Of Fall Of Forward Current - di/ dt (A/ µs)

Maximum Reverse Recovery Time - Trr (µs)

Maximum Reverse Recovery Time - Trr (µs)

3.6

Maximum Reverse Rec overy Current - Irr (A)

Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors

300 I FM = 750 A

250

Sq ua re Pulse

200

400 A

150

200 A

100

SD203N/ R..S20 Series TJ= 125 °C, V r = 30V

50 10 20 30 40 50 60 70 80 90 100

Rate Of Fall Of Forward Current - di/ dt (A/ µs)

Fig. 17 - Recovery Charge Characteristics

For technical questions, contact: [email protected]

Document Number: 93170 Revision: 08-Apr-08

SD203N/R Series

Maximum Reverse Recovery Current - Irr (A)

Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors

130 I FM = 750 A

120

Square Pulse

110 100

400 A

90 80

200 A

70 60 50 40 30

SD203N/ R..S20 Series TJ= 125 °C, V r = 30V

20 10 20 30 40 50 60 70 80 90 100

Rate Of Fall Of Forward Current - di/ dt (A/ µs)

Fig. 18 - Recovery Current Characteristics 1E4 20 joules per pulse 20 joules per pulse

10 10 4

Peak Forward Current (A)

4 1

1E3

2 2 1

0.4 0.2 0.1

0.4 0.2

0.04

0.1

0.02

1E2

0.06

0.01 SD203N/ R..S10 Series Sinusoidal Pulse TJ= 125°C, VRRM= 1120V dv/ dt = 1000V/ µs

1E1 1E1

tp

1E2

1E3

1E4

1E1

SD203N/ R..S10 Series Trapezoidal Pulse TJ = 125°C, VRRM = 1120V dv/ dt=1000V/ µs, di/ dt=50A/ µs

1E2

1E3

1E4

Pulse Basewidth (µs)

Pulse Basewidth (µs)

Fig. 19 - Maximum Total Energy Loss Per Pulse Characteristics 1E4 20 joules per p ulse

20 joules per pulse

Peak Forward Current (A)

10

10 4

4 2 2

1

1E3

1

0.4 0.4

0.2 0.1

0.2

0.04 0.02

1E2

0.1

0.01

tp

1E1 1E1

SD203N/ R..S15 Series Sinusoidal Pulse TJ = 125°C, VRRM = 1120V dv/ dt = 1000V/ µs

1E2

tp

1E3

1E4

1E1

SD203N/ R..S15 Series Trapezoidal Pulse TJ= 125°C, VRRM = 1120V d v/ dt=1000V/ µs, di/ dt=50A/ µs

1E2

1E3

1E4

Pulse Basewidth (µs)

Pulse Basewidth (µs) Fig. 20 - Maximum Total Energy Loss Per Pulse Characteristics

Document Number: 93170 Revision: 08-Apr-08

For technical questions, contact: [email protected]

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SD203N/R Series Fast Recovery Diodes (Stud Version), 200 A

Vishay Semiconductors 1E4

20 joules per pulse

20 joules per p ulse

Peak Forward Current (A)

10

10

4

4

2

1E3

2

1

1

0.4

0.4

0.2 0.1

1E2

0.2

0.04

tp

SD203N/ R..S20 Series Sinusoidal Pulse TJ= 125°C, VRRM = 1760V dv/ dt = 1000V/ µs

1E1 1E1

0.02 0.01

1E2

tp

1E3

1E4

SD203N/ R..S20 Series Trapezoidal Pulse TJ= 125°C, VRRM = 1760V d v/ dt=1000V/ µs, di/ dt=50A/ µs

1E1

1E2

1E3

1E4

Pulse Basewidth (µs)

Pulse Basewidth (µs) Fig. 21 - Maximum Total Energy Loss Per Pulse Characteristics

ORDERING INFORMATION TABLE

Device code

SD

20

3

R

25

S20

P

B

C

1

2

3

4

5

6

7

8

9

1

-

Diode

2

-

Essential part number

3

-

3 = Fast recovery

4

-

N = Stud normal polarity (cathode to stud) R = Stud reverse polarity (anode to stud)

5

-

Voltage code x 100 = VRRM (see Voltage Ratings table)

6

-

trr code (see Recovery Characteristics table)

7

-

P = Stud base DO-205AB (DO-9) 3/4" 16UNF-2A M = Stud base DO-205AB (DO-9) M16 x 1.5

8

-7

B = Flag top terminals (for cathode/ anode leads) S = Isolated lead with silicon sleeve (red = Reverse polarity; blue = Normal polarity) None = Not isolated lead

9

-

C = Ceramic housing (over 1600 V) V = Glass-metal seal (only up to 1600 V)

LINKS TO RELATED DOCUMENTS Dimensions

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http://www.vishay.com/doc?95301

For technical questions, contact: [email protected]

Document Number: 93170 Revision: 08-Apr-08

Outline Dimensions Vishay Semiconductors

DO-205AB (DO-9) DIMENSIONS in millimeters (inches) Ceramic housing

19 (0.75) MAX.

4 (0.16) MAX.

39 (1.53) MAX.

9.5 (0.37) MIN.

DIA. 8.5 (0.33) NOM.

C.S. 35 mm2 (0.054 s.i.)

210 (8.27) ± 10 (0.39) DIA. 27.5 (1.08) MAX. 82 (3.23) MIN.

SW 32 16 (0.63) MAX. 21 (0.82) MAX.

3/4"-16UNF-2A*

Document Number: 95301 Revision: 09-Apr-08

*For metric device: M16 x 1.5 contact factory

For technical questions, contact: [email protected]

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Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.

Material Category Policy Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant. Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU. Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21 conform to JEDEC JS709A standards.

Revision: 02-Oct-12

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Document Number: 91000