Gap Pad 1000SF ®
July 2011 PRODUCT DESCRIPTION Thermally Conductive, Silicone-Free Gap Filling Material FEATURES AND BENEFITS • Thermal conductivity: 0.9 W/m-K
TYPICAL PROPERTIES OF GAP PAD 1000SF
PROPERTY Color
IMPERIAL VALUE Green
METRIC VALUE Green
TEST METHOD Visual
Reinforcement Carrier
Fiberglass
Fiberglass
—
Thickness (inch) / (mm)
0.010 to 0.125
0.254 to 3.175
ASTM D374
2
2
—
• No silicone extraction
Density (g/cc)
2.0
2.0
ASTM D792
• Reduced tack on one side to aid in application assembly
Heat Capacity (J/g-K)
1.1
1.1
ASTM E1269
Hardness, Bulk Rubber (Shore 00) (1)
40
40
ASTM D2240
• No silicone outgassing
• Electrically isolating
Inherent Surface Tack (1- or 2-sided)
Young’s Modulus (psi) / (kPa) (2)
34
234
ASTM D575
Continuous Use Temp (°F) / (°C)
-76 to 257
-60 to 125
—
ELECTRICAL Dielectric Breakdown Voltage (Vac)
>6000
>6000
ASTM D149
Dielectric Constant (1000 Hz)
5.0
5.0
ASTM D150
Volume Resistivity (Ohm-meter)
1010
1010
ASTM D257
Flame Rating
V-1
V-1
U.L. 94
THERMAL Thermal Conductivity (W/m-K)
0.9
0.9
ASTM D5470
1) Thirty second delay value Shore 00 hardness scale. 2) Young's Modulus, calculated using 0.01 in/min. step rate of strain with a sample size of 0.79 inch2. For more information on Gap Pad modulus, refer to Bergquist Application Note #116.
Note: To build a part number, visit our website at www.bergquistcompany.com.
TYPICAL APPLICATIONS INCLUDE • Digital disk drives / CD-ROM • Automotive modules • Fiber optics modules CONFIGURATIONS AVAILABLE • Sheet form and die-cut parts
Resultant Thickness (mils)
The new Gap Pad® 1000SF is a thermally conductive, electrically insulating, siliconefree polymer specially designed for silicone-sensitive applications.The material is ideal for applications with high standoff and flatness tolerances. Gap Pad® 1000SF is reinforced for easy material handling and added durability during assembly.The material is available with a protective liner on both sides of the material.The topside has reduced tack for ease of handling.
Thickness vs. Thermal Resistance Gap Pad 1000SF
125 100 75 50 25 0
0
1 2 3 4 Thermal Resistance (C-in2/W)
5
PDS_GP_1000SF_0711
TDS Gap Pad® 1000SF, July 2011 Disclaimer
Note: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. The product can have a variety of different applications as well as differing application and working conditions in your environment that are beyond our control. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Belgium NV, Henkel Electronic Materials NV, Henkel Nederland BV, Henkel Technologies France SAS and Henkel France SA please additionally note the following: In case Henkel would be nevertheless held liable, on whatever legal ground, Henkel’s liability will in no event exceed the amount of the concerned delivery. In case products are delivered by Henkel Colombiana, S.A.S. the following disclaimer is applicable: The information provided in this Technical Data Sheet (TDS) including the recommendations for use and application of the product are based on our knowledge and experience of the product as at the date of this TDS. Henkel is, therefore, not liable for the suitability of our product for the production processes and conditions in respect of which you use them, as well as the intended applications and results. We strongly recommend that you carry out your own prior trials to confirm such suitability of our product. Any liability in respect of the information in the Technical Data Sheet or any other written or oral recommendation(s) regarding the concerned product is excluded, except if otherwise explicitly agreed and except in relation to death or personal injury caused by our negligence and any liability under any applicable mandatory product liability law. In case products are delivered by Henkel Corporation, Resin Technology Group, Inc., or Henkel Canada Corporation, the following disclaimer is applicable: The data contained herein are furnished for information only and are believed to be reliable. We cannot assume responsibility for the results obtained by others over whose methods we have no control. It is the user’s responsibility to determine suitability for the user’s purpose of any production methods mentioned herein and to adopt such precautions as may be advisable for the protection of property and of persons against any hazards that may be involved in the handling and use thereof. In light of the foregoing, Henkel Corporation specifically disclaims all warranties expressed or implied, including warranties of merchantability or fitness for a particular purpose, arising from sale or use of Henkel Corporation’s products. Henkel Corporation specifically disclaims any liability for consequential or incidental damages of any kind, including lost profits. The discussion herein of various processes or compositions is not to be interpreted as representation that they are free from domination of patents owned by others or as a license under any Henkel Corporation patents that may cover such processes or compositions. We recommend that each prospective user test his proposed application before repetitive use, using this data as a guide. This product may be covered by one or more United States or foreign patents or patent applications. Trademark usage Except as otherwise noted, all trademarks in this document are trademarks of Henkel Corporation in the U.S. and elsewhere. ® denotes a trademark registered in the U.S. Patent and Trademark Office
Reference 0.1
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