Hirose Products for IOT Devices

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◗◗◗◗ C O N N E C T I N G

T HE

F U T UR E

Products for Internet of Things Devices As all kinds of devices from consumer and industrial devices to devices for social infrastructure are being connected to the network, Internet of Information is gradually shifting to Internet of Things (IoT). Total number of IoT devices is expected to reach 50 billion units by 2020. Hirose Electric provides a variety of products suitable to IoT devices.(See the product list on the back of this page.) Building Telemedicine Security

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HRS Connectors on Intel® Edison Hirose Electricʼs connectors are incorporated in the Intel® Edison development platform as a board-to-board I/F connector and a coaxial connector for external antenna.

Intel® Edison Development Platform

1

Intel® Edison Breakout Board

C

Breakout Board (Expansion board for embedded system development)

2

1

Front

B

Back

A DF40-70pos. (Receptacle): Board to Board I/F Connector HRS Part Name: DF40C-70DS-0.4V(51) [Stacking Height 1.5mm] DF40C(2.0)-70DS-0.4V(51) [Stacking Height 2.0mm] DF40HC(3.0)-70DS-0.4V(51) [Stacking Height 3.0mm]

A

B DF40-70pos. (Header): Board to Board I/F Connector HRS Part Name: DF40C-70DP-0.4V(51)

2

Intel® Edison Compute Module Compute Module (General-purpose computing platform)

C U.FL (Receptacle, Plug): Coaxial connector for external antenna

HRS Part Name: U.FL-R-SMT-1 U.FL-LP-040 [Stacking Height 2.5mm, Cable ø0.81] U.FL-LP-066 [Stacking Height 2.5mm, Cable ø1.13/1.32] U.FL-LP(V)-040 [Stacking Height 2.0mm, Cable ø0.81]

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https://www.hirose.com 2300 Warrenville Rd., Suite 150, Downers Grove, IL 60515 • T: 630-282-6700 • www.hirose.com • US-IoT-FLY-16-067-1.0

HRS Products for IoT Devices ◗ Module Connection

Pitch (mm)

Stacking Height (mm)

Depth (mm)

Pin Count

Max. Rated Current (A)

DF17

0.5

4.0 to 8.0

5.7

20 to 80

0.3

DF12

0.5

3.0, 3.5, 4.0, 5.0

4.6

10 to 80

0.3

DF40

0.4

1.5 to 4.0

3.38

10 to 100

0.3

0.4

1.5, 3.0

3.68

30 to 70

0.3

0.4

0.98, 1.5

2.98

10 to 74

0.3

0.35

0.6, 0.8

1.98

6 to 30

0.3

● Board to Board Connector

DF17

DF12

DF40

DF40G

*1

DF37 BM23FR DF37

DF40G

*1

BM23FR

Shielded connector supporting high speed transmission

◗ I/O Connection

Display and Sensor Connection

I/O Connection

● I/O Connector

ZX Micro USB 2.0

ZX360 Micro USB 3.0

Antenna Connection GX CX70M 0.4mm pitch USB Type C Compact I/F Connector

Module Connection

◗ Antenna Connection

Frequency (GHz)

Occupied Mounting Area (mm)

DC to 6

3.0 x 3.1

2.0, 2.5

DC to 6

2.0 x 2.0

1.65, 1.4 (W.FL) 1.18 (W.FL2)

DC to 6 DC to 12 (Low Loss)

2.0 x 2.0

1.0 1.3 (Low Loss)

Frequency (GHz)

Occupied Mounting Area (mm)

Max. Stacking Height (mm)

MS-162

DC to 11

3.5 x 3.1

2.5

MS-156C3

DC to 11

2.3 x 2.3

1.35

MS-180

DC to 11

1.8 x 1.8

0.85

● Micro Coaxial Connector U.FL W.FL/ W.FL2 U.FL

W.FL

X.FL

X.FL

● Micro Coaxial Switch

MS-162

MS-156C3

MS-180

Max. Stacking Height (mm)

◗ Display and Sensor Connection Pitch (mm)

Stacking Height (mm)

Depth (mm)

Pin Count

Max. Rated Current (A)

1.2

1.4

4.65

2 to 6

2.5

DF50

1.0

7.35 9.0 *3

20 to 50

1

DF52

0.8

1.75

● Wire to Board Connector DF57H

DF57H

DF50

DF52

*1

*1

Vertical mating with lateral connecting cable type

FH58/FH58M

BM29

FH35C

BM22

*3

4.1 *2

2 to 20

Straight mating type

*3

2.5 Right-angle mating type

Stacking Height (mm)

Depth (mm)

Pin Count

Max. Rated Current (A)

0.5/1.0

2.0

5.7

6 to 60

0.5

FH34SRJ

0.5

1.0

3.2

4 to 50

0.5

FH35C

0.3

0.9

3.2

9 to 61

0.2

0.2/0.25

0.9

3.1

7 to 71

0.2

BM29

0.35

0.6

1.5

2

3A for power 0.3A for signal

BM22

-

0.9

2.64

4 to 6

4A for power 0.3A for signal

FH52

FH34SRJ

*2

Pitch (mm)

● FPC/FFC Connector

FH52

8.78 8.96

*2

FH58/FH58M

*Specifications herein are subject to change without notice. Contact Hirose for latest specifications and details. © 2016 HIROSE ELECTRIC CO., LTD. All rights reserved.

HIROSE ELECTRIC CO., LTD.

Issued: April 28, 2016