Hirose's Connectors for Smart Glass & Head Mount Display
R13021E_1 (Page 1 of 7)
Hirose’s Connectors for Smart Glass & Head Mount Display 3. Main and I/O Board Connection
1. Display/Projection/Camera Connection FH58 Series
FH35C Series
BM23FR Series
0.2 mm Pitch, 0.9 mm Height, Top/Bottom Contact Connector
0.3 mm Pitch, Top & Bottom Contact
0.6/0.8 Height, 1.98 mm Depth, 0.35 mm Pitch, B to FPC Connector
DF81 Series
DF36 Series 0.4 mm Pitch, Vertical Mating Micro-Coaxial Connector
0.4 mm Pitch, 0.9 mm Height, Horizontal Mating Micro-Coaxial Connector with Rotary Latch
4. Interface Connection CX70M USB Type C connector
3. Module & Main board Connection DF49 Series 0.4 mm Pitch, 0.7 mm Height, Horizontal Mating Micro-Coaxial Connector
6. Battery Connection DF56 Series
2. Speaker/Micro Phone Connection
0.3 mm Pitch, Vertical Mating Micro-Coaxial Connector
Swing Lock, Low Profile Connector
DF57H Series
BM22 Series Micro Hybrid Board to FPC Connector Up to 4 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
5. Wireless Module Connection X.FL Series
MS-180 Series
Ultra Low Profile 0.94 mm Miniature RF Connector
Ultra Low Profile 0.85mm RF Switch for Checking Terminal
Issued: Nov 30, 2015
R13021E_1 (Page 2 of 7)
1. Connectors for Display/Projection/Camera Connection (High-Pin-Count) Board to FPC (1-Piece) FH29DJ
FH35C
FH36W
FH42
FH43BW
FH53
FH58
Bottom Contact Pitch: 0.2 mm Height: 1.2 mm Depth: 4.5 mm Pin Counts: 44 to 120 pos. Rated Current: 0.25 Amps
Top/Bottom Contact Pitch: 0.3 mm Height: 0.9 mm Depth: 3.2 mm Pin Counts: 9 to 61 pos. Rated Current: 0.2 Amps
Bottom Contact Pitch: 0.3 mm Height: 0.95 mm Depth: 2.7 mm Pin Counts: 11 to 61 pos. Rated Current: 0.2 Amps
Top Contact Pitch: 0.3 mm Height: 0.65 mm Depth: 3.08 mm Pin Counts: 7 to 41 pos. Rated Current: 0.2 Amps
Bottom Contact Pitch: 0.2 mm Height: 0.9 mm Depth: 2.77 mm Pin Counts: 21 to 71 pos. Rated Current: 0.2 Amps
Top Contact Pitch: 0.2/0.25 mm Height: 0.65 mm Depth: 3.2 mm Pin Counts: 11 to 41/ 7 to 41 pos. Rated Current: 0.2 Amps
Top/Bottom Contact Pitch: 0.2/0.25 mm Height: 0.9 mm Depth: 3.1 mm Pin Counts: 11 to 71/ 7 to 71 pos. Rated Current: 0.2 Amps
Board to FPC (2-Piece) DF37
BM10
Pitch: 0.4 mm Stacking Height: 0.98/1.5 mm Depth: 2.98 mm Pin Counts: 10 to 74 pos. Rated Current: 0.3 Amps
Pitch: 0.4 mm Stacking Height: 0.6/0.8 mm Depth: 2.98 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
Board to Wire KN13
BM20
Pitch: 0.4 mm Stacking Height: 0.8 mm Depth: 2.5 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Pitch: 0.4 mm Stacking Height: 0.8 mm Depth: 2.3 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
BM23FR
Pitch: 0.35 mm Stacking Height: 0.6/0.8 mm Depth: 1.98 mm Pin Counts: 6 to 60 pos. Rated Current: 0.3 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
DF57H
DF52
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
Issued: Nov 30, 2015
R13021E_1 (Page 3 of 7)
2. Connectors for Speaker/Microphone Connection (Low-Pin-Count) Board to FPC (2-Piece) DF37
Pitch: 0.4 mm Stacking Height: 0.98/1.5 mm Depth: 2.98 mm Pin Counts: 10 to 74 pos. Rated Current: 0.3 Amp
BM29
DF40
Pitch: 0.35 mm Stacking Height: 0.6 mm Depth: 1.5 mm Pin Counts: 2 to 10 pos. Rated Current: Power 3 Amps Signal 0.3 Amps
Board to FPC (1-Piece) FH19C
Bottom Contact Pitch: 0.5 mm Height: 0.9 mm Depth: 3.0 mm Pin Counts: 4 to 50 pos. Rated Current: 0.5 Amps
Pitch: 0.4 mm Stacking Height: 0.6/0.8 mm Depth: 2.30 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
BM15FR
Pitch: 0.35 mm Stacking Height: 0.7/0.8/1.0 mm Depth: 1.98 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
Board to Wire
FH34SRJ
DF57H
Top/Bottom Contact Pitch: 0.5 mm Height: 1.0 mm Depth: 3.2 mm Pin Counts: 4 to 50 pos. Rated Current: 0.5 Amps
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Pitch: 0.4 mm Stacking Height: 1.5 to 4.0 mm Depth: 2.98/3.38 mm Pin Counts: 10 to 100 pos. Rated Current: 0.3 Amps
BM20
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
DF52
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 4 of 7)
3. Connector for Module, Main and I/O Board Connection Board to Micro Coaxial Cable DF36
Vertical Mating Pitch: 0.4 mm Mated Height: 1.5 mm Mated Depth: 2.8/4.4 mm Pin Counts: 15 to 50 pos. AWG wire: 42 to 46 (Discrete: AWG wire 34, 36, φ0.33 Max.) Rated Current: 0.2 to 0.25 Amps
DF49
Horizontal Mating Pitch: 0.4 mm Mated Height: 0.7 mm Mated Depth: 4.83 mm Pin Counts: 20, (30), 40 pos. AWG wire: 42 to 46 (Discrete: AWG wire 34, 36, φ0.37 mm Max.) Rated Current: 0.15 to 0.25 Amps ※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
DF56
Vertical Mating Pitch: 0.3 mm (Staggered) Mated Height: 1.25 mm Mated Depth: 2.6 mm Pin Counts: 40, 50 pos. AWG wire: 42 to 46 (Discrete: AWG wire 36, φ0.42 Max.) Rated Current: 0.1 to 0.2 Amps
DF80
Vertical Mating Pitch: 0.5 mm Mated Height: 1.72 mm Mated Depth: 5.1 mm Pin Counts: 30, 40, 45, 50 pos. AWG wire: 40 to 46 (Discrete: AWG wire 32, 36, φ0.5 mm Max.) Rated Current: 0.1 to 0.5 Amps
DF81
With rotary latch Horizontal Mating Pitch: 0.4 mm Mated Height: 0.9 mm Mated Depth: 4.4 mm Pin Counts: 30, 40, 50 pos. AWG wire: 36 to 46 (Discrete: AWG wire 34, 36, 40, φ0.4 mm Max.) Rated Current: 0.15 to 0.8 Amps © 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 5 of 7)
4. Connectors for Interface Connection I/O ZX
Micro-USB2.0 Connectors
LX
0.5 mm Pitch Ultra-low Profile Interface Connectors 12, 16, and 20 pos.
ZX62W
ZX360
Overmolded Type Micro-USB2.0 Receptacles for Splash Resistance
ST
USB Type C connector
GX
0.5 mm Pitch Space Saving Interface Connectors 10, 18, 24 and 36 pos.
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Micro-USB3.0 Connectors
CX70M
0.4 mm pitch space-saving interface connectors 18, 22 and 28 pos.
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 6 of 7)
5. Connectors for Wireless module Connection Miniature RF X.FL
Mated Height: 1.0 mm Max. Frequency: DC to 12 GHz V.S.W.R.: 1.7 Max.
X.FL (Low Loss)
Mated Height: 1.3 mm Max. Frequency: DC to 12 GHz V.S.W.R.: 1.7 Max. Intel WiGig Recommended
X.FL (FPC-to-Board)
Mated Height: 0.89 mm Max. Frequency: DC to 6 GHz V.S.W.R.: 1.5 Max.
W.FL2
Mated Height: 1.3 mm Max. Frequency: DC to 6 GHz V.S.W.R.: 1.4 Max.
RF Switch MS-156C3
Height: 1.35 mm Frequency: DC to 11 GHz V.S.W.R.: 1.5 Max.
MS-180
Height: 0.85 mm Frequency: DC to 11 GHz V.S.W.R.: 1.4 Max.
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 7 of 7)
6. Connectors for Battery Connection Board to Wire DF57H
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
DF52
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
Board to FPC (2-Piece) BM22
Power/Signal Hybrid Connectors Mated Height: 0.9 mm Mated Depth: 2.64 mm Pin Counts: 4 and 6 pos. Rated Current: 4 Amps for power 0.3 Amps for signal
BM24
BM25
Power/Signal Hybrid Connectors Mated Height: 0.8 mm Mated Depth: 2.3 mm Pin Counts: 10 to 60 pos. Rated Current: 5 Amps for power 0.25 Amps for signal
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Power/Signal Hybrid Connectors Mated Height: 0.7 mm Mated Depth: 2.6 mm Pin Counts: 4 pos. Rated Current: 9 Amps for power 1 Amp for signal
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
BM29
Power/Signal Hybrid Connectors Pitch: 0.35 mm Stacking Height: 0.6 mm Depth: 1.5 mm Pin Counts: 2 to 10 pos. Rated Current: Power 3 Amps Signal 0.3 Amps Issued: Nov 30, 2015
Hirose’s Connectors for Smart Glass & Head Mount Display 3. Main and I/O Board Connection
1. Display/Projection/Camera Connection FH58 Series
FH35C Series
BM23FR Series
0.2 mm Pitch, 0.9 mm Height, Top/Bottom Contact Connector
0.3 mm Pitch, Top & Bottom Contact
0.6/0.8 Height, 1.98 mm Depth, 0.35 mm Pitch, B to FPC Connector
DF81 Series
DF36 Series 0.4 mm Pitch, Vertical Mating Micro-Coaxial Connector
0.4 mm Pitch, 0.9 mm Height, Horizontal Mating Micro-Coaxial Connector with Rotary Latch
4. Interface Connection CX70M USB Type C connector
3. Module & Main board Connection DF49 Series 0.4 mm Pitch, 0.7 mm Height, Horizontal Mating Micro-Coaxial Connector
6. Battery Connection DF56 Series
2. Speaker/Micro Phone Connection
0.3 mm Pitch, Vertical Mating Micro-Coaxial Connector
Swing Lock, Low Profile Connector
DF57H Series
BM22 Series Micro Hybrid Board to FPC Connector Up to 4 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
5. Wireless Module Connection X.FL Series
MS-180 Series
Ultra Low Profile 0.94 mm Miniature RF Connector
Ultra Low Profile 0.85mm RF Switch for Checking Terminal
Issued: Nov 30, 2015
R13021E_1 (Page 2 of 7)
1. Connectors for Display/Projection/Camera Connection (High-Pin-Count) Board to FPC (1-Piece) FH29DJ
FH35C
FH36W
FH42
FH43BW
FH53
FH58
Bottom Contact Pitch: 0.2 mm Height: 1.2 mm Depth: 4.5 mm Pin Counts: 44 to 120 pos. Rated Current: 0.25 Amps
Top/Bottom Contact Pitch: 0.3 mm Height: 0.9 mm Depth: 3.2 mm Pin Counts: 9 to 61 pos. Rated Current: 0.2 Amps
Bottom Contact Pitch: 0.3 mm Height: 0.95 mm Depth: 2.7 mm Pin Counts: 11 to 61 pos. Rated Current: 0.2 Amps
Top Contact Pitch: 0.3 mm Height: 0.65 mm Depth: 3.08 mm Pin Counts: 7 to 41 pos. Rated Current: 0.2 Amps
Bottom Contact Pitch: 0.2 mm Height: 0.9 mm Depth: 2.77 mm Pin Counts: 21 to 71 pos. Rated Current: 0.2 Amps
Top Contact Pitch: 0.2/0.25 mm Height: 0.65 mm Depth: 3.2 mm Pin Counts: 11 to 41/ 7 to 41 pos. Rated Current: 0.2 Amps
Top/Bottom Contact Pitch: 0.2/0.25 mm Height: 0.9 mm Depth: 3.1 mm Pin Counts: 11 to 71/ 7 to 71 pos. Rated Current: 0.2 Amps
Board to FPC (2-Piece) DF37
BM10
Pitch: 0.4 mm Stacking Height: 0.98/1.5 mm Depth: 2.98 mm Pin Counts: 10 to 74 pos. Rated Current: 0.3 Amps
Pitch: 0.4 mm Stacking Height: 0.6/0.8 mm Depth: 2.98 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
Board to Wire KN13
BM20
Pitch: 0.4 mm Stacking Height: 0.8 mm Depth: 2.5 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Pitch: 0.4 mm Stacking Height: 0.8 mm Depth: 2.3 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
BM23FR
Pitch: 0.35 mm Stacking Height: 0.6/0.8 mm Depth: 1.98 mm Pin Counts: 6 to 60 pos. Rated Current: 0.3 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
DF57H
DF52
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
Issued: Nov 30, 2015
R13021E_1 (Page 3 of 7)
2. Connectors for Speaker/Microphone Connection (Low-Pin-Count) Board to FPC (2-Piece) DF37
Pitch: 0.4 mm Stacking Height: 0.98/1.5 mm Depth: 2.98 mm Pin Counts: 10 to 74 pos. Rated Current: 0.3 Amp
BM29
DF40
Pitch: 0.35 mm Stacking Height: 0.6 mm Depth: 1.5 mm Pin Counts: 2 to 10 pos. Rated Current: Power 3 Amps Signal 0.3 Amps
Board to FPC (1-Piece) FH19C
Bottom Contact Pitch: 0.5 mm Height: 0.9 mm Depth: 3.0 mm Pin Counts: 4 to 50 pos. Rated Current: 0.5 Amps
Pitch: 0.4 mm Stacking Height: 0.6/0.8 mm Depth: 2.30 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
BM15FR
Pitch: 0.35 mm Stacking Height: 0.7/0.8/1.0 mm Depth: 1.98 mm Pin Counts: 10 to 60 pos. Rated Current: 0.3 Amps
Board to Wire
FH34SRJ
DF57H
Top/Bottom Contact Pitch: 0.5 mm Height: 1.0 mm Depth: 3.2 mm Pin Counts: 4 to 50 pos. Rated Current: 0.5 Amps
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Pitch: 0.4 mm Stacking Height: 1.5 to 4.0 mm Depth: 2.98/3.38 mm Pin Counts: 10 to 100 pos. Rated Current: 0.3 Amps
BM20
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
DF52
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 4 of 7)
3. Connector for Module, Main and I/O Board Connection Board to Micro Coaxial Cable DF36
Vertical Mating Pitch: 0.4 mm Mated Height: 1.5 mm Mated Depth: 2.8/4.4 mm Pin Counts: 15 to 50 pos. AWG wire: 42 to 46 (Discrete: AWG wire 34, 36, φ0.33 Max.) Rated Current: 0.2 to 0.25 Amps
DF49
Horizontal Mating Pitch: 0.4 mm Mated Height: 0.7 mm Mated Depth: 4.83 mm Pin Counts: 20, (30), 40 pos. AWG wire: 42 to 46 (Discrete: AWG wire 34, 36, φ0.37 mm Max.) Rated Current: 0.15 to 0.25 Amps ※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
DF56
Vertical Mating Pitch: 0.3 mm (Staggered) Mated Height: 1.25 mm Mated Depth: 2.6 mm Pin Counts: 40, 50 pos. AWG wire: 42 to 46 (Discrete: AWG wire 36, φ0.42 Max.) Rated Current: 0.1 to 0.2 Amps
DF80
Vertical Mating Pitch: 0.5 mm Mated Height: 1.72 mm Mated Depth: 5.1 mm Pin Counts: 30, 40, 45, 50 pos. AWG wire: 40 to 46 (Discrete: AWG wire 32, 36, φ0.5 mm Max.) Rated Current: 0.1 to 0.5 Amps
DF81
With rotary latch Horizontal Mating Pitch: 0.4 mm Mated Height: 0.9 mm Mated Depth: 4.4 mm Pin Counts: 30, 40, 50 pos. AWG wire: 36 to 46 (Discrete: AWG wire 34, 36, 40, φ0.4 mm Max.) Rated Current: 0.15 to 0.8 Amps © 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 5 of 7)
4. Connectors for Interface Connection I/O ZX
Micro-USB2.0 Connectors
LX
0.5 mm Pitch Ultra-low Profile Interface Connectors 12, 16, and 20 pos.
ZX62W
ZX360
Overmolded Type Micro-USB2.0 Receptacles for Splash Resistance
ST
USB Type C connector
GX
0.5 mm Pitch Space Saving Interface Connectors 10, 18, 24 and 36 pos.
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Micro-USB3.0 Connectors
CX70M
0.4 mm pitch space-saving interface connectors 18, 22 and 28 pos.
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 6 of 7)
5. Connectors for Wireless module Connection Miniature RF X.FL
Mated Height: 1.0 mm Max. Frequency: DC to 12 GHz V.S.W.R.: 1.7 Max.
X.FL (Low Loss)
Mated Height: 1.3 mm Max. Frequency: DC to 12 GHz V.S.W.R.: 1.7 Max. Intel WiGig Recommended
X.FL (FPC-to-Board)
Mated Height: 0.89 mm Max. Frequency: DC to 6 GHz V.S.W.R.: 1.5 Max.
W.FL2
Mated Height: 1.3 mm Max. Frequency: DC to 6 GHz V.S.W.R.: 1.4 Max.
RF Switch MS-156C3
Height: 1.35 mm Frequency: DC to 11 GHz V.S.W.R.: 1.5 Max.
MS-180
Height: 0.85 mm Frequency: DC to 11 GHz V.S.W.R.: 1.4 Max.
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
Issued: Nov 30, 2015
R13021E_1 (Page 7 of 7)
6. Connectors for Battery Connection Board to Wire DF57H
Pitch: 1.2 mm Mated Height: 1.4 mm Depth: 4.35 mm Pin Counts: 2 to 6 pos. AWG wire: 28 to 34 Rated Current: 0.5 to 2.5 Amps
DF52
Pitch: 0.8 mm Stacking Height: 1.75 mm Depth: 4.1 mm Pin Counts: 2 to 20 pos. Rated Current: 0.8 to 2.5 Amps
Board to FPC (2-Piece) BM22
Power/Signal Hybrid Connectors Mated Height: 0.9 mm Mated Depth: 2.64 mm Pin Counts: 4 and 6 pos. Rated Current: 4 Amps for power 0.3 Amps for signal
BM24
BM25
Power/Signal Hybrid Connectors Mated Height: 0.8 mm Mated Depth: 2.3 mm Pin Counts: 10 to 60 pos. Rated Current: 5 Amps for power 0.25 Amps for signal
※Variations under development are included. Confirm latest information through your HRS contact person. (As of Nov, 2015)
Power/Signal Hybrid Connectors Mated Height: 0.7 mm Mated Depth: 2.6 mm Pin Counts: 4 pos. Rated Current: 9 Amps for power 1 Amp for signal
© 2015 HIROSE ELECTRIC CO., LTD. All rights reserved.
BM29
Power/Signal Hybrid Connectors Pitch: 0.35 mm Stacking Height: 0.6 mm Depth: 1.5 mm Pin Counts: 2 to 10 pos. Rated Current: Power 3 Amps Signal 0.3 Amps Issued: Nov 30, 2015
