INTEGRATED COMPUTATIONAL MATERIAL ENGINEERING FOR ...

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Verification of Integrated Computational Material Engineering for Virtual Life Management® of Medical Devices S. Kulkarni*, R. Tryon#, K. Merdan*, G. Krishnan# ASTM Third Symposium on Fatigue and Fracture Metallic Medical Materials and Devices

* Boston Scientific, # Vextec Corporation

November 14, 2012 Hyatt Regency Atlanta, GA

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Talk Outline

• • • • •

ICME Technology Virtual Twin® Application to MP35N Lead Simulations Results Perspectives and Summary

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Integrated Computational Material Science

• Virtual Twin – Computer model that represent all structural aspects of a component (or system)

Integrated Computational Materials Engineering: A Transformational Discipline for Improved Competitiveness and National Security (http://www.nap.edu/catalog/12199.html) Copyright © 2012 by Boston Scientific Corporation or its affiliates. All rights reserved.

Virtual Twin Used to Determine Costs

• Computation methods are available to determine blue line (loads) • Red line (capacity) is traditionally determined with lots and lots of testing • ICME determines red line using computational methods and less testing

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ICME Extends FEA to Durability Analysis Standard Industry Analysis

Design & Stress

With ICME

Life & Where & Why

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Material Structures Models 1. Grain energy input into well known and accepted material science damage equations

2. Grain lives statistically combined into element life; then component life

3. Actual “mission” simulation by sequencing FEA models and repeating above steps Mission Cycle 1 2 3 4 5

Component Life Usage

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risk area

Knowledge & Rules Fatigue Analysis

• Crack nucleation

• Small crack growth

• Long crack growth Copyright © 2012 by Boston Scientific Corporation or its affiliates. All rights reserved.

MP35N Lead VT Objective Demonstrate VLM Technology • Ability to predict product durability under varying conditions • Provide understanding of technology and the benefits of VT Simulators

Specifically….. • Simulate fatigue buckling test under 2 load conditions • Conduct Sensitivity Studies around principal durability drivers • Provide opportunity to compare predicted trends against known trends

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Simulator Set-up for MP35N Wire Rotating Bend Fatigue Test

Grain Size

Residual Stress

Particle Size J. E. Schaffer: Ph.D. Thesis, Purdue, 2007 Copyright © 2012 by Boston Scientific Corporation or its affiliates. All rights reserved.

Fatigue Mechanisms Nucleation

Small Crack Growth

Near-initiation, cracked TiN particle

Crack front arrest at microstructural features.

Chevron crack-initiating feature

Striation spacing at crack front J. E. Schaffer: Ph.D. Thesis, Purdue, 2007

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Perform Simulations on Wire Test

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Fatigue Test Design Set-up for MP35N Leads

Cond1: A”+/-a” Cond2: B”+/-b”

Condition 1: A” Von Mises Stress; Max Stress=XX ksi

• • • •

Simulation of two test conditions – Displacements A” and B” Cycling between maximum displacement and 0 displacement Cycling to 1E10 cycles and Runout (suspension) if no failure Measured difference in maximum Von-Mises stress between Conditions 1 and 2 Copyright © 2012 by Boston Scientific Corporation or its affiliates. All rights reserved.

Condition 2: B” Von Mises Stress; Max Stress=YY ksi

MP35N Coil Simulation Set-up • • • •

Define geometry and stress with FEA Define microstructure with metallography Run Simulation Calibrate to residual stress profile with experimental data

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Sensitivity Study Virtual Design of Experiments – Applied displacement – Residual stress profile – Inclusion size distribution



Top durability drivers

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– Residual Stress – 10% improvement yields 60% improvement in mean total life – Inclusion Size – 50% smaller inclusion size yields 25% improvement in mean total life – Inclusion Density- 50% lower inclusion density; No significant impact – Trade-off threshold exists between residual stress and inclusion size

Global Perspective and Summary •

Able to Characterize MP35N lead design • Material Microstructure (grain size, inclusion size and density) • Residual Stress



Developed Insights • Concept or design alternatives • Material substitution or vendor management



Potential application of VLM • Sensitivity analysis • Design trade studies • Supplier controls • Design optimization • Next Steps – new materials and new designs

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