SKY65165-11: 2.4-2.5 GHz, 0.25 W WLAN Power Amplifier

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PRELIMINARY DATA SHEET

SKY65165-11: 2.4-2.5 GHz, 0.25 W WLAN Power Amplifier Applications

Description

 IEEE 802.11 b/g/n WLANs  ISM band transmitters  Wireless access point, routers, gateways

The SKY65165-11 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65165-11 ideal for Wireless Local Area Network (WLAN) applications. The high linearity (low EVM) and high efficiency of this device makes it ideal for use in the transmit chain of WLAN access points or modems.

VCC1

VCC2

GND

16

15

14

13

1

12

GND

GND

2

11

RF_OUT2

Y1

3

10

RF_OUT1

Y2

4

9

GND

5

6

7

8

VDET

RF_IN

N/C

Skyworks offers lead (Pb)-free RoHS (Restriction of Hazardous Substances) compliant packaging.

The pin configuration and package are shown in Figure 1. A functional block diagram is shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.

VC_BIAS

 Small, QFN (16-pin, 3 x 3 mm) package (MSL1, 260 C per JEDEC J-STD-020)

The SKY65165-11 is fabricated using Skyworks high reliability Heterojunction Bipolar Transistor (HBT) InGaP process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is internally matched at the RF input and mounted in a 16-pin, 3 x 3 mm Quad Flat NoLead (QFN) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution.

GND

 EVM < 2.5% for POUT > +24 dBm @ 5 V  High gain = 32.5 dB @ 5 V  Internal active bias circuits  Internal on/off control circuit  Internal, high dynamic range power detector  Dual DC supply operation: 3.3 V and 5.0 V

PA_EN

Features

S1918

Figure 1. SKY65165-11 Pinout – 16-Pin QFN (Top View)

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

VC_BIAS

PA_EN

RF_IN

InterStage Match

Input Match

VCC1

VDET

Detector

Active Bias

InterStage Match

Output Matching Circuit

RF Output

Stage 3 Collector Voltage

VCC2

S1919

Figure 2. SKY65165-11 Block Diagram

Table 1. SKY65165-11 Signal Descriptions Pin #

Note:

Name

Description

Pin #

Name

Description

1

RF_IN

RF input

9

GND

Ground

2

GND

Ground

10

RF_OUT1

RF output 1

3

Y1

Input to interstage inductor

11

RF_OUT2

RF output 2

4

Y2

Output to interstage inductor

12

GND

Ground

5

PA_EN

PA on/off control signal (on = +3 V to VCC; off = 0 to 0.5 V)

13

GND

Ground

6

VC_BIAS

Bias voltage (5 V)

14

VCC2

Stage 2 collector voltage (5 V)

7

N/C

No connect

15

VCC1

Stage 1 collector voltage (5 V)

8

VDET

Detector supply voltage

16

GND

Ground

The center ground pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.

Functional Description The SKY65165-11 is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. It contains all of the needed RF matching. An in-module active bias circuit is included within the device for all three amplifier stages, which provides excellent gain tracking over temperature and voltage variations. The first and second output stages are independently supplied using the VCC1 and VCC2 signals (pins 15 and 14, respectively). The DC control voltage that sets the bias for all three stages is supplied by the VC_BIAS signal (pin 4). The Evaluation Board includes shunt decoupling capacitors on these pins to suppress any possible bias affect on the RF signal at low frequencies. The SKY65165-11 includes an internal PA enable control pin (pin 5) for fast RF on/off control. Zero volts turns off the PA while 3 to 5 V enables the PA. The device also provides an output power detector voltage, VDET, at pin 8. Pin 1 is the RF input and pins 10 and 11 are the RF outputs. External DC blocking or RF matching is required on the RF output.

Grounding is through several ground pins and the package center ground. These features make the device suitable for wideband digital applications where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.

Electrical and Mechanical Specifications The absolute maximum ratings of the SKY65165-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Performance characteristics for the SKY65165-11 are illustrated in Figures 3 through 6.

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Table 2. SKY65165-11 Absolute Maximum Ratings (Note 1) Parameter

Symbol

RF output power

POUT

Supply voltage (VCC1, VCC2, VC_BIAS)

VCC

Total supply current

ICC

Minimum

Maximum

Units

+31

dBm

4.5

5.5

V

700

mA

Power dissipation

PD

*** TBD ***

W

Thermal resistance

ΘJC

*** TBD ***

°C/W

Junction temperature

TJ

+150

C

Case temperature

TC

–40

+85

C

Storage temperature

TSTG

–55

+125

C

Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.

CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SKY65165-11 Recommended Operating Conditions Parameter

Symbol

RF output power

POUT

Supply voltage (VCC1, VCC2, VC_BIAS)

VCC

PA enable

PA_EN

Total supply current

ICC

Minimum

Typical

Maximum

Units

+24 3.0

dBm

5.0

3

5.5

V

5

V

400

Operating frequency

f

2412

Case temperature

TC

–40

mA

+25

2483

MHz

+85

C

Table 4. SKY65165-11 Electrical Specifications: 5.0 V Performance (Note 1) (VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted) Parameter

Symbol

Test Condition

Min

Typical

Max

220

250

Units

Continuous Wave Input Signal Quiescent current

ICCQ

Operational current

ICC

POUT = +24 dBm

mA

330

mA

1 dB Output Compression Point

OP1dB

+31.2

dBm

Noise Figure

NF

4.6

dB

Small signal gain

|S21|

33.5

dB

Gain variation across band

0.6

dB

Input return loss

|S11|

2.4 to 2.5 GHz

15

dB

Output return loss

|S22|

9

dB

Detector voltage

VDET

POUT = +24 dBm

0.6

V

2nd harmonic

2fo

POUT = +24 dBm

–28

dBm

3rd harmonic

3fo

POUT = +24 dBm

–41

dBm

IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps Error Vector Magnitude

EVM

POUT = +24 dBm

2.5

%

Average operational current

ICC

802.11g, POUT = +24 dBm

285

mA

Note 1: Performance is guaranteed only under the conditions listed in this Table.

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Table 5. SKY65165-11 Electrical Specifications: 3.3 V Performance (Note 1) (VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted) Parameter

Symbol

Test Condition

Min

Typical

Max

Units

Continuous Wave Input Signal Quiescent current

ICCQ

Operational current

ICC

1 dB Output Compression Point

OP1dB

Noise Figure

NF

Small signal gain

|S21|

Gain variation across band

POUT = +20 dBm

2.4 to 2.5 GHz

95

mA

180

mA

+28.3

dBm

4

dB

30.8

dB

0.5

dB

Input return loss

|S11|

15

dB

Output return loss

|S22|

9

dB

Detector voltage

VDET

POUT = +20 dBm

370

mV

2nd harmonic

2fo

POUT = +20 dBm

–25

dBm

3rd harmonic

3fo

POUT = +20 dBm

–35

dBm

IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps Error Vector Magnitude

EVM

POUT = +20 dBm

Average operational current

ICC

802.11g, POUT = +20 dBm

3

%

135

mA

Note 1: Performance is guaranteed only under the conditions listed in this Table.

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Typical Performance Characteristics: 5.0 V (VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

9

12 4.5 V 5.0 V 5.5 V

11 10 9

7 6

7

EVM (%)

EVM (%)

8 6 5 4

5 4 3

3

2

2 1

1

0

2412 MHz 2442 MHz 2462 MHz

8

0

+4

+8

+12

+16

+20

+24

0

+28

0

+4

+8

+16

+20

+24

+28

Figure 4. EVM vs Output Power Over Frequency @ 5.0 V

Figure 3. EVM vs Output Power Over Frequency Over Voltage

34.5

34.5

34.0

34.0

33.5

33.5

Gain (dB)

Gain (dB)

+12

Output Power (dBm)

Output Power (dBm)

33.0 32.5

2412 MHz 2442 MHz 2462 MHz

33.0 32.5

32.0 4.5 V 5.0 V 5.5 V

31.5 31.0

32.0 31.5

0

+5

+10

+15

+20

+25

+30

+35

0

+5

+10

+20

+25

+30

+35

Figure 6. Output Power vs Gain Over Frequency (CW, VCC = 5.0 V)

Figure 5. Output Power vs Gain Over Voltage (CW)

1.6

800

1.4

700

1.2

600

Current (mA)

Detector Voltage (V)

+15

Output Power (dBm)

Output Power (dBm)

1.0 0.8 0.6

500 400 300 200

0.4 2412 MHz 2442 MHz 2462 MHz

0.2

4.5 V 5.0 V 5.5 V

100 0

0 0

+5

+10

+15

+20

+25

+30

+35

Output Power (dBm)

Figure 7. Detector Voltage vs Output Power Over Frequency (CW, VCC = 5.0 V)

0

+5

+10

+15

+20

+25

+30

+35

Output Power (dBm)

Figure 8. Output Power vs Current Over Voltage (CW)

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5

800

+35

700

+30

600

+25

Output Power (dBm)

Current (mA)

DATA SHEET • SKY65165-11 POWER AMPLIFIER

500 400 300 200 2412 MHz 2442 MHz 2462 MHz

100 0

0

+5

+10

+15

+20

+25

+20 +15 +10 2412 MHz 2442 MHz 2462 MHz

+5

+30

0 –30

+35

–25

–20

Output Power (dBm)

–15

–10

–5

0

Input Power (dBm)

Figure 9. Output Power vs Current Over Frequency (CW, VCC = 5.0 V)

Figure 10. Output Power vs Input Power (CW, VCC = 5.0 V)

–10

4.8

–15

4.6

–25

Noise Figure (dB)

Harmonic Level (dBm)

–20

–30 –35 –40 –45 2fo 3fo

–50

4.4 4.2 4.0 3.8

–55 –60 +18

+19

+20

+21

+22

+23

+24

+25

+26

+27

3.6 2400

+28

2420

2440

Output Power (dBm)

Figure 11. Harmonic Level vs Output Power

Mask

–10

2412 MHz 2442 MHz 2462 MHz

0 Mask

–10 –20

–30

–30

dBr

–20

–40

–40

–50

–50

–60

–60

–70

–70 –0.04

–0.02

0

+0.02

+0.04

+0.06

Normalized Frequency (GHz)

Figure 13. Spectral Mask Over Frequency (802.11b CCK, 11 Mbps, POUT = +28 dBm, VCC = 5.0 V)

–80 –0.06

–0.04

–0.02

0

+0.02

+0.04

+0.06

Normalized Frequency (GHz)

Figure 14. Spectral Mask Over Frequency (802.11b CCK, 1 Mbps, POUT = +28 dBm, VCC = 5.0 V)

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2500

+10 2412 MHz 2442 MHz 2462 MHz

0

dBr

2480

Figure 12. Noise Figure vs Frequency

+10

–80 –0.06

2460

Frequency (MHz)

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

+10 0

2412 MHz 2442 MHz 2462 MHz

Mask

–10

dBr

–20 –30 –40 –50 –60 –70 –0.06

–0.04

–0.02

0

+0.02

+0.04

+0.06

Normalized Frequency (GHz)

Figure 15. Spectral Mask Over Frequency (64 QAM OFDM, 54 Mbps, POUT = +26 dBm, VCC = 5.0 V)

Typical Performance Characteristics: 3.3 V (VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)

16 14

12 10 9

10

8

8

7

EVM (%)

EVM (%)

2412 MHz 2442 MHz 2462 MHz

11

12

6

6 5 4

4 2412 MHz 2442 MHz 2462 MHz

2 0 0

+4

+8

+12

+16

+20

+24

3 2 1 0 +4

+28

+6

Output Power (dBm)

+8

+10

+12

+14

+16

+18

+20

+22

+24

+26

Output Power (dBm)

Figure 16. EVM vs Output Power Over Frequency @ 3.3 V (802.11g, 64 QAM, 54 Mbps)

Figure 17. EVM vs Output Power Over Frequency @ 3.6 V (802.11g, 64 QAM, 54 Mbps) 600

+31.5

500

Current (mA)

+31.0

Gain (dBm)

+30.5 +30.0 +29.5

400 300 200

+29.0 2412 MHz 2442 MHz 2462 MHz

+28.5 +28.0

0

+2

+4

+6

+8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 +32

Output Power (dBm)

Figure 18. Gain vs Output Power Over Frequency (CW, VCC = 3.3 V)

2412 MHz 2442 MHz 2462 MHz

100 0

0

+2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30

Output Power (dBm)

Figure 19. Current vs Output Power (CW, VCC = 3.3 V)

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

4.8

1.2

4.6

1.0

4.4

Noise Figure (dB)

Detector Voltage (V)

1.4

0.8 0.6 0.4 2412 MHz 2442 MHz 2462 MHz

0.2

4.0 3.8 3.6 3.4 3.2

0 0

4.2

3.0 2400

+2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30

2420

2440

Output Power (dBm)

–10

+10

–15 –20

–10

–25 –30

–30

0

2500

2412 MHz 2442 MHz 2462 MHz

Mask

–20

–35 –40 –45

–40 –50 –60

2fo 3fo

–50 –55 +19

+20

+21

+22

+23

+24

+25

+26

+27

–70 –80 –0.06

+28

–0.04

–0.02

0

+0.02

+0.04

+0.06

Normalized Frequency (GHz)

Output Power (dBm)

Figure 23. Spectral Mask Over Frequency (802.11b CCK, 11 Mbps, POUT = +25 dBm, VCC = 3.3 V)

Figure 22. Harmonic Level vs Output Power (CW)

+10

+10 Mask

–10

2412 MHz 2442 MHz 2462 MHz

0

2412 MHz 2442 MHz 2462 MHz

0

Mask

–10

–20

–20

–30

dBr

dBr

2480

Figure 21. Noise Figure vs Frequency

dBr

Harmonic Level (dBm)

Figure 20. Detector Voltage vs Output Power Over Frequency (CW, VCC = 3.3 V)

–60 +18

2460

Frequency (MHz)

–40

–30 –40

–50 –60

–50

–70

–60

–80 –0.06

–0.04

–0.02

0

+0.02

+0.04

+0.06

Normalized Frequency (GHz)

Figure 24. Spectral Mask Over Frequency (802.11b CCK, 1 Mbps, POUT = +24 dBm, VCC = 3.3 V)

–70 –0.06

–0.04

–0.02

0

+0.02

+0.04

Figure 25. Spectral Mask Over Frequency (802.11b OFDM, 54 Mbps, POUT = +22 dBm, VCC = 3.3 V)

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+0.06

Normalized Frequency (GHz)

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Evaluation Board Description The SKY65165-11 Evaluation Board is used to test the performance of the SKY65165-11 PA. A typical application schematic diagram is provided in Figure 26. An assembly drawing for the Evaluation Board is shown in Figure 27.

NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device. Evaluation Board Test Procedure

An Evaluation Board layer detail drawing is shown in Figure 28. Layer detail physical characteristics are noted in Figure 29. Table 5 provides the Bill of Materials (BOM) list for Evaluation Board components.

Step 1: Connect a +5 V supply to the VCC1, VCC2, VC_BIAS, VDET, and PA_EN pins. If available, enable the current limiting function of the power supply to 500 mA.

Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration:

Step 3: Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of –15 dBm or less to the Evaluation Board. DO NOT enable the RF signal.

1. Paths to ground should be made as short as possible.

Step 4: Connect a spectrum analyzer to the RF signal output port.

2. The ground pad of the SKY65165-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required.

Step 5: Enable the power supply.

For further information, refer to the Skyworks Application Note, PCB Design Guidelines for HIgh Power Dissipation Packages, document number 201211. 3. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the VCC supply line to block RF signals from the DC supply. Refer to the schematic drawing in Figure 26 for further details.

Step 2: If desired, connect a voltage meter to the VDET pin.

Step 6: Enable the RF signal. Step 7: Take measurements. CAUTION: If the input signal exceeds the rated power, the SKY65165-11 Evaluation Board can be permanently damaged. NOTE: It is important to adjust the VCC voltage source so that +5 V is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.

4. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation.

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

C18 10 μF

C20 8.2 pF L8 12 nH

Stage 1 Collector Voltage (5 V)

L9 12 nH

Stage 2 Collector Voltage (5 V)

C21 10 pF

L7 4.7 nH

4

RF_OUT2

Y1

RF_OUT1

Y2

5

6

10 C28 2.4 pF

9

GND

7

PA Enable Bias Voltage

GND

VCC1

GND

L10 3.3 nH

11

Stage 3 Collector Voltage

C23 10 μF C25 1.2 pF

Transmission Line See Note

J2 C29 1.8 pF

RF Output C22 82 pF

VDET

3

C26 1.8 pF

12

GND

N/C

2

13

RF_IN

VC_BIAS

1

RF Input

PA_EN

J1

14

VCC2

15

GND

16

8

×

C16 8.2 pF

L11 8.2 nH

Detector Supply Voltage

C27 8.2 pF

Note: For 3.3 V operation, length = 6.5 mm, width = 0.5 mm. For 5.0 V operation, length = 7.0 mm, width = 0.5 mm

S1920

Figure 26. SKY65165-11 Typical Application Schematic

J2

C22 C26 C23

J5

C20

C27

L10

C25

C18

C29 L11

C28 C16 L9 C21 L8

J7

L7

J1 S1921

Figure 27. SKY65165-11 Evaluation Board Assembly Diagram

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Layer 1: Top – Metal

Layer 2: Ground

Layer 3: Power Plane

Layer 4: Solid Ground Plane S2009

Figure 28. SKY65165-11 Evaluation Board Layer Detail

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

Cross Section

Name Thickness (mm) Material Tmask

0.100

Solder Resist

L1

0.035

Cu – 1 oz

Dielectric

0.250

R04350

L2

0.035

Cu – 1 oz

Dielectric

0.350

FR4

L3

0.035

Cu – 1 oz

Dielectric

0.250

FR4

L4

0.035

Cu – 1 oz

Bmask

0.010

Solder Resist S2010

Figure 29. Evaluation Board Layer Detail Physical Characteristics

Table 5. SKY65165-11 Evaluation Board Bill of Materials Component

Value

SMT Size (Note 1)

C18, C23

10 μF

1206

C16, C20, C27

8.2 pF

0603

C22

82 pF

0603

C25

1.2 pF

0603

C26, C29

1.8 pF

0603

C28

2.4 pF

0603

L7

4.7 nH

0603

L10

3.3 nH

0603

L8, L9

12 nH

0603

Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. GND (pins 2, 9, 12, 13, and 16). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. PA_EN (pin 5). Internal PA enable control pin for fast on/off control (on = +3 V to VCC; off = 0 to 0.5 V). VC_BIAS (pin 6). The bias supply voltage for stages 1 and 2, typically set to +5 V. RF_OUT1 and RF_OUT2 (pins 10 and 11). Amplifier RF output pins. Third stage collector voltage is connected to these pins through an output match circuit. Capacitor C28 should be placed as close as possible to the SKY65165-11. For 3.3 V operation, C29 should be placed 6.5 mm from capacitor C28. For 5.0 V

operation, capacitor C29 should be placed 7.0 mm from capacitor C28. Y1 and Y2 (pins 3 and 4). Interstage inductor input and output pins. N/C (pin 7). This pin is open and may or may not be connected to ground. VCC2 (pin 14). Supply voltage for the second stage collector bias (typically +5 V). To bypass VCC2, capacitors C8 and C16 (see Figure 7) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical. VDET (pin 8). The power detector output voltage signal. This pin may be connected to PA_EN (pin 5). The benefit of this is that the current draw consumed by the detector will not be wasted with the device in the off state. VCC1 (pin 15). Supply voltage for the first stage collector bias (typically +5 V). To bypass VCC1, capacitors C5 and C15 (see Figure 7) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical.

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

RF_IN (pin 1). Amplifier RF input pin (ZO = 50 Ω). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.

Package and Handling Information Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.

Package Dimensions The PCB layout footprint for the SKY65165-11 is shown in Figure 30. Typical case markings are shown in Figure 31. Package dimensions for the 16-pin QFN are shown in Figure 32, and tape and reel dimensions are provided in Figure 33.

THE SKY65165-11 is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.

16X 1.10

0.225 X 45o

0.25

1.70

4x Plated Through Vias

12X 0.50 Pitch

See Detail A Metal Ground Pad 1.70 0.25

Exposed Soldering Area 0.60

Detail A All dimensions are in millimeters

S1691

Figure 30. SKY65165-11 PCB Layout Footprint

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010

13

DATA SHEET • SKY65165-11 POWER AMPLIFIER

*** TBD ***

Figure 31. SKY65165-11 Typical Case Markings

1.70 +0.10/–0.15

–C–

(0.20) Seating Plane

–A–

3.00

–B–

Pin 1 Indicator

–A–

Exposed Pad

0.85

0.02 + 0.03/–0.02

O.225 x 45o Pin 1 Indicator

0.85 –B–

3.00

0.15 C

2X

2X

1.70 +0.10/–0.15

Detail B

16X 2 0.08 C

0.15 C

Detail A

0.75 ± 0.05 0.10 C

Top View

Side View

Bottom View

0.40 ± 0.10

0.5 0.25 0.25 +0.05/–0.07 0.10 M C A B 0.05 M C

Detail A

Detail B Scale: 10X

Scale: 20X 16 Places All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Coplanarity applies to the exposed heat sink slug as well as the terminals.. Plating requirement per source control drawing (SCD) 2504.

S1692

Figure 32. SKY65165-11 16-Pin QFN Package Dimensions

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DATA SHEET • SKY65165-11 POWER AMPLIFIER

4.00 ± 0.10 Pin #1

2.00 ± 0.05

1.75 ± 0.10

A

5.50 ± 0.05

3.30 ± 0.10 (Bo)

B

A

12.00 ± 0.30

0.30 ± 0.05 (T)

∅1.50 + 0.1/–0.0

8.00 ± 0.10

B

1.10 ± 0.10 (Ko)

B

R0.25 Typ.

∅1.50 Min.

3.30 ± 0.10 (Ao)

A Notes: 1. Carrier tape: black conductive polystyrene, non-bakeable material. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 9.20 mm width. 4. All measurements are in millimeters.

S1698

Figure 33. SKY65165-11 16-Pin QFN Tape and Reel Dimensions

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • [email protected] • www.skyworksinc.com 201246B • Skyworks Proprietary and Confidential Information • Products and Product Information are Subject to Change Without Notice • June 10, 2010

15

DATA SHEET • SKY65165-11 POWER AMPLIFIER

Ordering Information Model Name SKY65165-11 WLAN Power Amplifier

Manufacturing Part Number SKY65165-11

Evaluation Board Part Number TW18-D405-003

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