PRELIMINARY DATA SHEET
SKY65165-11: 2.4-2.5 GHz, 0.25 W WLAN Power Amplifier Applications
Description
IEEE 802.11 b/g/n WLANs ISM band transmitters Wireless access point, routers, gateways
The SKY65165-11 is a Microwave Monolithic Integrated Circuit (MMIC) Power Amplifier (PA) with superior output power, linearity, and efficiency. These features make the SKY65165-11 ideal for Wireless Local Area Network (WLAN) applications. The high linearity (low EVM) and high efficiency of this device makes it ideal for use in the transmit chain of WLAN access points or modems.
VCC1
VCC2
GND
16
15
14
13
1
12
GND
GND
2
11
RF_OUT2
Y1
3
10
RF_OUT1
Y2
4
9
GND
5
6
7
8
VDET
RF_IN
N/C
Skyworks offers lead (Pb)-free RoHS (Restriction of Hazardous Substances) compliant packaging.
The pin configuration and package are shown in Figure 1. A functional block diagram is shown in Figure 2. Signal pin assignments and functional pin descriptions are provided in Table 1.
VC_BIAS
Small, QFN (16-pin, 3 x 3 mm) package (MSL1, 260 C per JEDEC J-STD-020)
The SKY65165-11 is fabricated using Skyworks high reliability Heterojunction Bipolar Transistor (HBT) InGaP process, which allows for single supply operation while maintaining high efficiency and good linearity. The device is internally matched at the RF input and mounted in a 16-pin, 3 x 3 mm Quad Flat NoLead (QFN) Surface-Mounted Technology (SMT) package, which allows for a highly manufacturable low cost solution.
GND
EVM < 2.5% for POUT > +24 dBm @ 5 V High gain = 32.5 dB @ 5 V Internal active bias circuits Internal on/off control circuit Internal, high dynamic range power detector Dual DC supply operation: 3.3 V and 5.0 V
PA_EN
Features
S1918
Figure 1. SKY65165-11 Pinout – 16-Pin QFN (Top View)
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
VC_BIAS
PA_EN
RF_IN
InterStage Match
Input Match
VCC1
VDET
Detector
Active Bias
InterStage Match
Output Matching Circuit
RF Output
Stage 3 Collector Voltage
VCC2
S1919
Figure 2. SKY65165-11 Block Diagram
Table 1. SKY65165-11 Signal Descriptions Pin #
Note:
Name
Description
Pin #
Name
Description
1
RF_IN
RF input
9
GND
Ground
2
GND
Ground
10
RF_OUT1
RF output 1
3
Y1
Input to interstage inductor
11
RF_OUT2
RF output 2
4
Y2
Output to interstage inductor
12
GND
Ground
5
PA_EN
PA on/off control signal (on = +3 V to VCC; off = 0 to 0.5 V)
13
GND
Ground
6
VC_BIAS
Bias voltage (5 V)
14
VCC2
Stage 2 collector voltage (5 V)
7
N/C
No connect
15
VCC1
Stage 1 collector voltage (5 V)
8
VDET
Detector supply voltage
16
GND
Ground
The center ground pad must have a low inductance and low thermal resistance connection to the printed circuit board ground plane.
Functional Description The SKY65165-11 is a three-stage, HBT InGaP device optimized for high linearity and power efficiency. It contains all of the needed RF matching. An in-module active bias circuit is included within the device for all three amplifier stages, which provides excellent gain tracking over temperature and voltage variations. The first and second output stages are independently supplied using the VCC1 and VCC2 signals (pins 15 and 14, respectively). The DC control voltage that sets the bias for all three stages is supplied by the VC_BIAS signal (pin 4). The Evaluation Board includes shunt decoupling capacitors on these pins to suppress any possible bias affect on the RF signal at low frequencies. The SKY65165-11 includes an internal PA enable control pin (pin 5) for fast RF on/off control. Zero volts turns off the PA while 3 to 5 V enables the PA. The device also provides an output power detector voltage, VDET, at pin 8. Pin 1 is the RF input and pins 10 and 11 are the RF outputs. External DC blocking or RF matching is required on the RF output.
Grounding is through several ground pins and the package center ground. These features make the device suitable for wideband digital applications where PA linearity and power consumption are of critical importance (e.g., WLANs). The device has been characterized with the highest specified data rates for 802.11b (11 Mbps) and 802.11g (54 Mbps). Under these stringent test conditions, the device exhibits excellent spectral purity and power efficiency.
Electrical and Mechanical Specifications The absolute maximum ratings of the SKY65165-11 are provided in Table 2. The recommended operating conditions are specified in Table 3 and electrical specifications are provided in Table 4. Performance characteristics for the SKY65165-11 are illustrated in Figures 3 through 6.
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Table 2. SKY65165-11 Absolute Maximum Ratings (Note 1) Parameter
Symbol
RF output power
POUT
Supply voltage (VCC1, VCC2, VC_BIAS)
VCC
Total supply current
ICC
Minimum
Maximum
Units
+31
dBm
4.5
5.5
V
700
mA
Power dissipation
PD
*** TBD ***
W
Thermal resistance
ΘJC
*** TBD ***
°C/W
Junction temperature
TJ
+150
C
Case temperature
TC
–40
+85
C
Storage temperature
TSTG
–55
+125
C
Note 1: Exposure to maximum rating conditions for extended periods may reduce device reliability. There is no damage to device with only one parameter set at the limit and all other parameters set at or below their nominal value. Exceeding any of the limits listed here may result in permanent damage to the device.
CAUTION: Although this device is designed to be as robust as possible, Electrostatic Discharge (ESD) can damage this device. This device must be protected at all times from ESD. Static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. Industry-standard ESD precautions should be used at all times. Table 3. SKY65165-11 Recommended Operating Conditions Parameter
Symbol
RF output power
POUT
Supply voltage (VCC1, VCC2, VC_BIAS)
VCC
PA enable
PA_EN
Total supply current
ICC
Minimum
Typical
Maximum
Units
+24 3.0
dBm
5.0
3
5.5
V
5
V
400
Operating frequency
f
2412
Case temperature
TC
–40
mA
+25
2483
MHz
+85
C
Table 4. SKY65165-11 Electrical Specifications: 5.0 V Performance (Note 1) (VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted) Parameter
Symbol
Test Condition
Min
Typical
Max
220
250
Units
Continuous Wave Input Signal Quiescent current
ICCQ
Operational current
ICC
POUT = +24 dBm
mA
330
mA
1 dB Output Compression Point
OP1dB
+31.2
dBm
Noise Figure
NF
4.6
dB
Small signal gain
|S21|
33.5
dB
Gain variation across band
0.6
dB
Input return loss
|S11|
2.4 to 2.5 GHz
15
dB
Output return loss
|S22|
9
dB
Detector voltage
VDET
POUT = +24 dBm
0.6
V
2nd harmonic
2fo
POUT = +24 dBm
–28
dBm
3rd harmonic
3fo
POUT = +24 dBm
–41
dBm
IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps Error Vector Magnitude
EVM
POUT = +24 dBm
2.5
%
Average operational current
ICC
802.11g, POUT = +24 dBm
285
mA
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Table 5. SKY65165-11 Electrical Specifications: 3.3 V Performance (Note 1) (VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted) Parameter
Symbol
Test Condition
Min
Typical
Max
Units
Continuous Wave Input Signal Quiescent current
ICCQ
Operational current
ICC
1 dB Output Compression Point
OP1dB
Noise Figure
NF
Small signal gain
|S21|
Gain variation across band
POUT = +20 dBm
2.4 to 2.5 GHz
95
mA
180
mA
+28.3
dBm
4
dB
30.8
dB
0.5
dB
Input return loss
|S11|
15
dB
Output return loss
|S22|
9
dB
Detector voltage
VDET
POUT = +20 dBm
370
mV
2nd harmonic
2fo
POUT = +20 dBm
–25
dBm
3rd harmonic
3fo
POUT = +20 dBm
–35
dBm
IEEE 802.11g Orthogonal Frequency Division Multiplexing Input Signal, 64 QAM, 54 Mbps Error Vector Magnitude
EVM
POUT = +20 dBm
Average operational current
ICC
802.11g, POUT = +20 dBm
3
%
135
mA
Note 1: Performance is guaranteed only under the conditions listed in this Table.
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Typical Performance Characteristics: 5.0 V (VCC1 = VCC2 = VC_BIAS = PA_EN = 5 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
9
12 4.5 V 5.0 V 5.5 V
11 10 9
7 6
7
EVM (%)
EVM (%)
8 6 5 4
5 4 3
3
2
2 1
1
0
2412 MHz 2442 MHz 2462 MHz
8
0
+4
+8
+12
+16
+20
+24
0
+28
0
+4
+8
+16
+20
+24
+28
Figure 4. EVM vs Output Power Over Frequency @ 5.0 V
Figure 3. EVM vs Output Power Over Frequency Over Voltage
34.5
34.5
34.0
34.0
33.5
33.5
Gain (dB)
Gain (dB)
+12
Output Power (dBm)
Output Power (dBm)
33.0 32.5
2412 MHz 2442 MHz 2462 MHz
33.0 32.5
32.0 4.5 V 5.0 V 5.5 V
31.5 31.0
32.0 31.5
0
+5
+10
+15
+20
+25
+30
+35
0
+5
+10
+20
+25
+30
+35
Figure 6. Output Power vs Gain Over Frequency (CW, VCC = 5.0 V)
Figure 5. Output Power vs Gain Over Voltage (CW)
1.6
800
1.4
700
1.2
600
Current (mA)
Detector Voltage (V)
+15
Output Power (dBm)
Output Power (dBm)
1.0 0.8 0.6
500 400 300 200
0.4 2412 MHz 2442 MHz 2462 MHz
0.2
4.5 V 5.0 V 5.5 V
100 0
0 0
+5
+10
+15
+20
+25
+30
+35
Output Power (dBm)
Figure 7. Detector Voltage vs Output Power Over Frequency (CW, VCC = 5.0 V)
0
+5
+10
+15
+20
+25
+30
+35
Output Power (dBm)
Figure 8. Output Power vs Current Over Voltage (CW)
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5
800
+35
700
+30
600
+25
Output Power (dBm)
Current (mA)
DATA SHEET • SKY65165-11 POWER AMPLIFIER
500 400 300 200 2412 MHz 2442 MHz 2462 MHz
100 0
0
+5
+10
+15
+20
+25
+20 +15 +10 2412 MHz 2442 MHz 2462 MHz
+5
+30
0 –30
+35
–25
–20
Output Power (dBm)
–15
–10
–5
0
Input Power (dBm)
Figure 9. Output Power vs Current Over Frequency (CW, VCC = 5.0 V)
Figure 10. Output Power vs Input Power (CW, VCC = 5.0 V)
–10
4.8
–15
4.6
–25
Noise Figure (dB)
Harmonic Level (dBm)
–20
–30 –35 –40 –45 2fo 3fo
–50
4.4 4.2 4.0 3.8
–55 –60 +18
+19
+20
+21
+22
+23
+24
+25
+26
+27
3.6 2400
+28
2420
2440
Output Power (dBm)
Figure 11. Harmonic Level vs Output Power
Mask
–10
2412 MHz 2442 MHz 2462 MHz
0 Mask
–10 –20
–30
–30
dBr
–20
–40
–40
–50
–50
–60
–60
–70
–70 –0.04
–0.02
0
+0.02
+0.04
+0.06
Normalized Frequency (GHz)
Figure 13. Spectral Mask Over Frequency (802.11b CCK, 11 Mbps, POUT = +28 dBm, VCC = 5.0 V)
–80 –0.06
–0.04
–0.02
0
+0.02
+0.04
+0.06
Normalized Frequency (GHz)
Figure 14. Spectral Mask Over Frequency (802.11b CCK, 1 Mbps, POUT = +28 dBm, VCC = 5.0 V)
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2500
+10 2412 MHz 2442 MHz 2462 MHz
0
dBr
2480
Figure 12. Noise Figure vs Frequency
+10
–80 –0.06
2460
Frequency (MHz)
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
+10 0
2412 MHz 2442 MHz 2462 MHz
Mask
–10
dBr
–20 –30 –40 –50 –60 –70 –0.06
–0.04
–0.02
0
+0.02
+0.04
+0.06
Normalized Frequency (GHz)
Figure 15. Spectral Mask Over Frequency (64 QAM OFDM, 54 Mbps, POUT = +26 dBm, VCC = 5.0 V)
Typical Performance Characteristics: 3.3 V (VCC1 = VCC2 = VC_BIAS = PA_EN = 3.3 V, TC = 25 °C, f = 2.442 GHz, Characteristic Impedance [ZO] = 50 Ω, Unless Otherwise Noted)
16 14
12 10 9
10
8
8
7
EVM (%)
EVM (%)
2412 MHz 2442 MHz 2462 MHz
11
12
6
6 5 4
4 2412 MHz 2442 MHz 2462 MHz
2 0 0
+4
+8
+12
+16
+20
+24
3 2 1 0 +4
+28
+6
Output Power (dBm)
+8
+10
+12
+14
+16
+18
+20
+22
+24
+26
Output Power (dBm)
Figure 16. EVM vs Output Power Over Frequency @ 3.3 V (802.11g, 64 QAM, 54 Mbps)
Figure 17. EVM vs Output Power Over Frequency @ 3.6 V (802.11g, 64 QAM, 54 Mbps) 600
+31.5
500
Current (mA)
+31.0
Gain (dBm)
+30.5 +30.0 +29.5
400 300 200
+29.0 2412 MHz 2442 MHz 2462 MHz
+28.5 +28.0
0
+2
+4
+6
+8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30 +32
Output Power (dBm)
Figure 18. Gain vs Output Power Over Frequency (CW, VCC = 3.3 V)
2412 MHz 2442 MHz 2462 MHz
100 0
0
+2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30
Output Power (dBm)
Figure 19. Current vs Output Power (CW, VCC = 3.3 V)
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
4.8
1.2
4.6
1.0
4.4
Noise Figure (dB)
Detector Voltage (V)
1.4
0.8 0.6 0.4 2412 MHz 2442 MHz 2462 MHz
0.2
4.0 3.8 3.6 3.4 3.2
0 0
4.2
3.0 2400
+2 +4 +6 +8 +10 +12 +14 +16 +18 +20 +22 +24 +26 +28 +30
2420
2440
Output Power (dBm)
–10
+10
–15 –20
–10
–25 –30
–30
0
2500
2412 MHz 2442 MHz 2462 MHz
Mask
–20
–35 –40 –45
–40 –50 –60
2fo 3fo
–50 –55 +19
+20
+21
+22
+23
+24
+25
+26
+27
–70 –80 –0.06
+28
–0.04
–0.02
0
+0.02
+0.04
+0.06
Normalized Frequency (GHz)
Output Power (dBm)
Figure 23. Spectral Mask Over Frequency (802.11b CCK, 11 Mbps, POUT = +25 dBm, VCC = 3.3 V)
Figure 22. Harmonic Level vs Output Power (CW)
+10
+10 Mask
–10
2412 MHz 2442 MHz 2462 MHz
0
2412 MHz 2442 MHz 2462 MHz
0
Mask
–10
–20
–20
–30
dBr
dBr
2480
Figure 21. Noise Figure vs Frequency
dBr
Harmonic Level (dBm)
Figure 20. Detector Voltage vs Output Power Over Frequency (CW, VCC = 3.3 V)
–60 +18
2460
Frequency (MHz)
–40
–30 –40
–50 –60
–50
–70
–60
–80 –0.06
–0.04
–0.02
0
+0.02
+0.04
+0.06
Normalized Frequency (GHz)
Figure 24. Spectral Mask Over Frequency (802.11b CCK, 1 Mbps, POUT = +24 dBm, VCC = 3.3 V)
–70 –0.06
–0.04
–0.02
0
+0.02
+0.04
Figure 25. Spectral Mask Over Frequency (802.11b OFDM, 54 Mbps, POUT = +22 dBm, VCC = 3.3 V)
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+0.06
Normalized Frequency (GHz)
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Evaluation Board Description The SKY65165-11 Evaluation Board is used to test the performance of the SKY65165-11 PA. A typical application schematic diagram is provided in Figure 26. An assembly drawing for the Evaluation Board is shown in Figure 27.
NOTE: A poor connection between the slug and ground increases junction temperature (TJ), which reduces the lifetime of the device. Evaluation Board Test Procedure
An Evaluation Board layer detail drawing is shown in Figure 28. Layer detail physical characteristics are noted in Figure 29. Table 5 provides the Bill of Materials (BOM) list for Evaluation Board components.
Step 1: Connect a +5 V supply to the VCC1, VCC2, VC_BIAS, VDET, and PA_EN pins. If available, enable the current limiting function of the power supply to 500 mA.
Circuit Design Considerations The following design considerations are general in nature and must be followed regardless of final use or configuration:
Step 3: Connect a signal generator to the RF signal input port. Set it to the desired RF frequency at a power level of –15 dBm or less to the Evaluation Board. DO NOT enable the RF signal.
1. Paths to ground should be made as short as possible.
Step 4: Connect a spectrum analyzer to the RF signal output port.
2. The ground pad of the SKY65165-11 has special electrical and thermal grounding requirements. This pad is the main thermal conduit for heat dissipation. Since the circuit board acts as the heat sink, it must shunt as much heat as possible from the device. Therefore, design the connection to the ground pad to dissipate the maximum wattage produced by the circuit board. Multiple vias to the grounding layer are required.
Step 5: Enable the power supply.
For further information, refer to the Skyworks Application Note, PCB Design Guidelines for HIgh Power Dissipation Packages, document number 201211. 3. Bypass capacitors should be used on the DC supply lines. An RF inductor is required on the VCC supply line to block RF signals from the DC supply. Refer to the schematic drawing in Figure 26 for further details.
Step 2: If desired, connect a voltage meter to the VDET pin.
Step 6: Enable the RF signal. Step 7: Take measurements. CAUTION: If the input signal exceeds the rated power, the SKY65165-11 Evaluation Board can be permanently damaged. NOTE: It is important to adjust the VCC voltage source so that +5 V is measured at the board. The high collector currents will drop the collector voltage significantly if long leads are used. Adjust the bias voltage to compensate.
4. The RF lines should be well separated from each other with solid ground in between traces to maximize input-to-output isolation.
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
C18 10 μF
C20 8.2 pF L8 12 nH
Stage 1 Collector Voltage (5 V)
L9 12 nH
Stage 2 Collector Voltage (5 V)
C21 10 pF
L7 4.7 nH
4
RF_OUT2
Y1
RF_OUT1
Y2
5
6
10 C28 2.4 pF
9
GND
7
PA Enable Bias Voltage
GND
VCC1
GND
L10 3.3 nH
11
Stage 3 Collector Voltage
C23 10 μF C25 1.2 pF
Transmission Line See Note
J2 C29 1.8 pF
RF Output C22 82 pF
VDET
3
C26 1.8 pF
12
GND
N/C
2
13
RF_IN
VC_BIAS
1
RF Input
PA_EN
J1
14
VCC2
15
GND
16
8
×
C16 8.2 pF
L11 8.2 nH
Detector Supply Voltage
C27 8.2 pF
Note: For 3.3 V operation, length = 6.5 mm, width = 0.5 mm. For 5.0 V operation, length = 7.0 mm, width = 0.5 mm
S1920
Figure 26. SKY65165-11 Typical Application Schematic
J2
C22 C26 C23
J5
C20
C27
L10
C25
C18
C29 L11
C28 C16 L9 C21 L8
J7
L7
J1 S1921
Figure 27. SKY65165-11 Evaluation Board Assembly Diagram
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Layer 1: Top – Metal
Layer 2: Ground
Layer 3: Power Plane
Layer 4: Solid Ground Plane S2009
Figure 28. SKY65165-11 Evaluation Board Layer Detail
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
Cross Section
Name Thickness (mm) Material Tmask
0.100
Solder Resist
L1
0.035
Cu – 1 oz
Dielectric
0.250
R04350
L2
0.035
Cu – 1 oz
Dielectric
0.350
FR4
L3
0.035
Cu – 1 oz
Dielectric
0.250
FR4
L4
0.035
Cu – 1 oz
Bmask
0.010
Solder Resist S2010
Figure 29. Evaluation Board Layer Detail Physical Characteristics
Table 5. SKY65165-11 Evaluation Board Bill of Materials Component
Value
SMT Size (Note 1)
C18, C23
10 μF
1206
C16, C20, C27
8.2 pF
0603
C22
82 pF
0603
C25
1.2 pF
0603
C26, C29
1.8 pF
0603
C28
2.4 pF
0603
L7
4.7 nH
0603
L10
3.3 nH
0603
L8, L9
12 nH
0603
Application Circuit Notes Center Ground. It is extremely important to sufficiently ground the bottom ground pad of the device for both thermal and stability reasons. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. GND (pins 2, 9, 12, 13, and 16). Attach all ground pins to the RF ground plane with the largest diameter and lowest inductance via that the layout allows. Multiple small vias are acceptable and will work well under the device if solder migration is an issue. PA_EN (pin 5). Internal PA enable control pin for fast on/off control (on = +3 V to VCC; off = 0 to 0.5 V). VC_BIAS (pin 6). The bias supply voltage for stages 1 and 2, typically set to +5 V. RF_OUT1 and RF_OUT2 (pins 10 and 11). Amplifier RF output pins. Third stage collector voltage is connected to these pins through an output match circuit. Capacitor C28 should be placed as close as possible to the SKY65165-11. For 3.3 V operation, C29 should be placed 6.5 mm from capacitor C28. For 5.0 V
operation, capacitor C29 should be placed 7.0 mm from capacitor C28. Y1 and Y2 (pins 3 and 4). Interstage inductor input and output pins. N/C (pin 7). This pin is open and may or may not be connected to ground. VCC2 (pin 14). Supply voltage for the second stage collector bias (typically +5 V). To bypass VCC2, capacitors C8 and C16 (see Figure 7) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical. VDET (pin 8). The power detector output voltage signal. This pin may be connected to PA_EN (pin 5). The benefit of this is that the current draw consumed by the detector will not be wasted with the device in the off state. VCC1 (pin 15). Supply voltage for the first stage collector bias (typically +5 V). To bypass VCC1, capacitors C5 and C15 (see Figure 7) should be placed in the approximate location shown on the Evaluation Board, although exact placement is not critical.
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
RF_IN (pin 1). Amplifier RF input pin (ZO = 50 Ω). The module includes an onboard internal DC blocking capacitor. All impedance matching is provided internal to the module.
Package and Handling Information Instructions on the shipping container label regarding exposure to moisture after the container seal is broken must be followed. Otherwise, problems related to moisture absorption may occur when the part is subjected to high temperature during solder assembly.
Package Dimensions The PCB layout footprint for the SKY65165-11 is shown in Figure 30. Typical case markings are shown in Figure 31. Package dimensions for the 16-pin QFN are shown in Figure 32, and tape and reel dimensions are provided in Figure 33.
THE SKY65165-11 is rated to Moisture Sensitivity Level 1 (MSL1) at 260 C. It can be used for lead or lead-free soldering. Care must be taken when attaching this product, whether it is done manually or in a production solder reflow environment. Production quantities of this product are shipped in a standard tape and reel format.
16X 1.10
0.225 X 45o
0.25
1.70
4x Plated Through Vias
12X 0.50 Pitch
See Detail A Metal Ground Pad 1.70 0.25
Exposed Soldering Area 0.60
Detail A All dimensions are in millimeters
S1691
Figure 30. SKY65165-11 PCB Layout Footprint
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13
DATA SHEET • SKY65165-11 POWER AMPLIFIER
*** TBD ***
Figure 31. SKY65165-11 Typical Case Markings
1.70 +0.10/–0.15
–C–
(0.20) Seating Plane
–A–
3.00
–B–
Pin 1 Indicator
–A–
Exposed Pad
0.85
0.02 + 0.03/–0.02
O.225 x 45o Pin 1 Indicator
0.85 –B–
3.00
0.15 C
2X
2X
1.70 +0.10/–0.15
Detail B
16X 2 0.08 C
0.15 C
Detail A
0.75 ± 0.05 0.10 C
Top View
Side View
Bottom View
0.40 ± 0.10
0.5 0.25 0.25 +0.05/–0.07 0.10 M C A B 0.05 M C
Detail A
Detail B Scale: 10X
Scale: 20X 16 Places All measurements are in millimeters. Dimensioning and tolerancing according to ASME Y14.5M-1994. Coplanarity applies to the exposed heat sink slug as well as the terminals.. Plating requirement per source control drawing (SCD) 2504.
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Figure 32. SKY65165-11 16-Pin QFN Package Dimensions
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DATA SHEET • SKY65165-11 POWER AMPLIFIER
4.00 ± 0.10 Pin #1
2.00 ± 0.05
1.75 ± 0.10
A
5.50 ± 0.05
3.30 ± 0.10 (Bo)
B
A
12.00 ± 0.30
0.30 ± 0.05 (T)
∅1.50 + 0.1/–0.0
8.00 ± 0.10
B
1.10 ± 0.10 (Ko)
B
R0.25 Typ.
∅1.50 Min.
3.30 ± 0.10 (Ao)
A Notes: 1. Carrier tape: black conductive polystyrene, non-bakeable material. 2. Cover tape material: transparent conductive HSA. 3. Cover tape size: 9.20 mm width. 4. All measurements are in millimeters.
S1698
Figure 33. SKY65165-11 16-Pin QFN Tape and Reel Dimensions
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15
DATA SHEET • SKY65165-11 POWER AMPLIFIER
Ordering Information Model Name SKY65165-11 WLAN Power Amplifier
Manufacturing Part Number SKY65165-11
Evaluation Board Part Number TW18-D405-003
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