SP4022 Series 1.3pF, 15A Discrete TVS Diode

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TVS Diode Arrays (SPA®® Diodes) Lightning Surge Protection- SP4022 Series

SP4022 Series 1.3pF, 15A Discrete TVS Diode

RoHS

Pb GREEN

Description The SP4022 series integrates low capacitance steering diodes with one or two zener diodes for unidirectional or bidirectional protection, respectively, to protect against ESD and lightning induced surge events. These devices can safely absorb up to 15A per IEC61000-4-5 (tp=8/20μs) without performance degradation and a minimum ±30kV ESD per IEC61000-4-2 International Standard. The low loading capacitance and high surge capability make it ideal for protecting telecommunication ports such as xDSL and other high voltage, high speed legacy interfaces.

Pinout

Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air

Pin 1

• EFT, IEC61000-4-4, 40A (5/50ns) • Lightning, IEC61000-4-5, 15A (tP=8/20μs)

• Low leakage current • Unidirectional and Bidirectional configuration • Small SOD323 package fits 0805 footprints • AEC-Q101 qualified

• Low capacitance of 1.3pF (@ VR=0V)

Pin 2

Functional Block Diagram

Applications

1

1

2

2

Unidirectional

Bidirectional

SP4022-01FTG SP4021-01FTG

SP4022-01FTG-C SP4021-01FTG-C

Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.

©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/06/15

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• xDSL Interfaces

• Security Equipment

• RS-232

• Instrumentation

• RS-485

• Medical Equipment

• Power Ports

• Computers and Peripherals

TVS Diode Arrays (SPA®® Diodes) Lightning Surge Protection- SP4022 Series

Absolute Maximum Ratings Symbol

Parameter

Value

IPP

Peak Current (tp=8/20μs)

PPk

Peak Pulse Power (tp=8/20μs)

TOP TSTOR

Units

15

A

500

W

Operating Temperature

-40 to 125

°C

Storage Temperature

-55 to 150

°C

Notes: CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

Thermal Information Parameter

Rating

Units

-55 to 150

°C

Maximum Junction Temperature

150

°C

Maximum Lead Temperature (Soldering 20-40s)

260

°C

Storage Temperature Range

Electrical Characteristics (TOP=25ºC) Parameter

Symbol

Test Conditions

Reverse Standoff Voltage

VRWM

IR≤1μA with Pin 1 to Pin 2

Breakdown Voltage

VBD

IT=1mA with Pin 1 to Pin 2

Leakage Current

ILEAK

VR=12V with Pin 1 to Pin 2

Clamp Voltage1

VC

Dynamic Resistance

RDYN

ESD Withstand Voltage1

VESD

2

Diode Capacitance1

CD

Min

Typ

Max

Units

12

V

13.3

V 0.1

μA

IPP=1A, tp=8/20µs, Fwd

19

V

IPP=2A, tp=8/20µs, Fwd

20

V

IPP=10A, tp=8/20µs, Fwd

28

IPP=15A, tp=8/20µs, Fwd

33

TLP tp=100ns, Pin 1 to Pin 2

0.5

IEC61000-4-2 (Contact Discharge)

±30

IEC61000-4-2 (Air Discharge)

±30

V 35

V Ω kV kV

Reverse Bias=0V, f=1MHz, Pin 1 to Pin 2

1.3

2

pF

Note: 1Parameter is guaranteed by design and/or device characterization. 2 Transmission Line Pulse (TLP) test setting : Std.TDR(50Ω),tp=100ns, tr=0.2ns ITLP and VTLP averaging window: star t1=70ns to end t2=80ns

Pulse Waveform

Capacitance vs. Reverse Bias (Pin 1 to Pin 2) 3.0

110% 100%

2.5

90%

2.0

70%

Capacitance (pF)

Percent of IPP

80%

60% 50% 40% 30% 20%

1.5

1.0

0.5

10% 0%

0.0

5.0

10.0

15.0

20.0

25.0

0.0

30.0

0

Time (μs)

2

3

4

5

6

7

Bias Voltage (V)

©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/06/15

1

574 2

8

9

10

11

12

TVS Diode Arrays (SPA®® Diodes) Lightning Surge Protection- SP4022 Series

Clamping Voltage vs. Peak Pulse Current (Pin 1 to Pin 2)

Transmission Line Pulsing (TLP) Plot (Pin 1 to Pin2) 25

40.0

20

30.0 25.0

TLP Current (A)

Clamp Voltage (VC )

35.0

20.0 15.0 10.0

15 10 5

5.0 0.0 1

3

5

7

9

Peak Pulse Current-I

11

PP

13

0

15

0

(A)

5

10

15

20

25

30

40

50

TLP Volts (V)

Soldering Parameters

Pre Heat

Pb – Free assembly

- Temperature Min (Ts(min))

150°C

- Temperature Max (Ts(max))

200°C

- Time (min to max) (ts)

60 – 180 secs

Average ramp up rate (Liquidus) Temp (TL) to peak

3°C/second max

TS(max) to TL - Ramp-up Rate

3°C/second max

Reflow

- Temperature (TL) (Liquidus)

217°C

- Temperature (tL)

60 – 150 seconds

Peak Temperature (TP)

260+0/-5 °C

Time within 5°C of actual peak Temperature (tp)

20 – 40 seconds

Ramp-down Rate

6°C/second max

Time 25°C to peak Temperature (TP)

8 minutes Max.

Do not exceed

260°C

Matte Tin

Lead Material

Copper Alloy

Lead Coplanarity

0.0004 inches (0.102mm)

Substrate material

Silicon

Body Material

Molded Epoxy

Flammability

UL 94 V-0

Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.

©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/06/15

575 3

Critical Zone TL to TP

Ramp-up

TL TS(max)

tL Ramp-do Ramp-down Preheat

TS(min)

25

Product Characteristics Lead Plating

tP

TP Temperature

Reflow Condition

tS time to peak temperature

Time

TVS Diode Arrays (SPA®® Diodes) Lightning Surge Protection- SP4022 Series

Part Marking System

Part Numbering System

SP4022 – 01 F T G – C Blank= Unidirectional C= Bidirectional G= Green T= Tape & Reel

SP4022-01FTG TVS Diode Arrays (SPA® Diodes ) Series Number of Channels

12 2

1

SP4022-01FTG-C

Package F: SOD323

Ordering Information

12C

Part Number

Package

Marking

Min. Order Qty.

SP4022-01FTG

SOD323

12

3000

SP4022-01FTG-C

SOD323

12C

3000

Package Dimensions -SOD323 E

SOD323

A2

Symbol

D

b

A1

A

E1

0.2

L1

Millimeters

Inches

Min

Max

Min

Max

A

0.80

1.14

0.031

0.045

A1

0.00

0.10

0.000

0.004

A2

0.80

1.04

0.031

0.014

b

0.25

0.35

0.010

0.014

c

0.08

0.15

0.003

0.006

D

1.15

1.45

0.045

0.057

Recommended Solder Pad

E

1.60

1.90

0.063

0.075

1.79

E1

2.44

2.70

0.096

0.106

L1

0.25

0.45

0.010

0.018

0.45

0.49

c

1.14 2.28 2.77

Unit: mm

Embossed Carrier Tape & Reel Specification — SOD323 2.00

4.00

ø1.50

ø178

1.75

0 8.

R7

6 5.

R2

12.3 3000 2500 2000

500

54.4

5.6

.5

1000

R2

R6

A

8.00

A

3.50

1500

B

Pin 1 Location

4.00

12.3

B 9.5

0.254

1.25

Cover Tape 2.90

1.46

A-A

B-B

©2015 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 01/06/15

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