High Temperature 200°C, C0G Dielectric, 10VDC-200VDC ...
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Overview
KEMET’s high temperature surface mount C0G Multilayer Ceramic Capacitors (MLCCs) feature a robust, proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200°C. This new platform promotes downsizing opportunities of existing high temperature C0G technology, and offers replacement opportunities of existing X7R/BX/BR technologies. KEMET’s high temperature C0G dielectric features a 200°C maximum operating temperature and is considered “stable.” The
Benefits • • • • • • • • • • • • •
-55°C to +200°C operating temperature range Pb-Free and RoHS compliant EIA 0603, 0805, 1206, 1210, 1812 & 2220 case sizes DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V Capacitance offerings ranging from 0.5pF up to 0.47μF Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10% or ±20% No piezoelectric noise Extremely low ESR and ESL High thermal stability High ripple current capability Preferred capacitance solution at line frequencies and into the MHz range No capacitance change with respect to applied rated DC voltage Negligible capacitance change with respect to temperature from -55°C to +200°C
Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from -55°C to +200°C.
• No capacitance decay with time • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated end metallization allowing for excellent solderability
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes.
Ordering Information C
1210
H
124
J
5
G
A
C
TU
Ceramic
Case Size (L" x W")
Specification/ Series
Capacitance Code (pF)
Capacitance Tolerance1
Voltage
Dielectric
Failure Rate/ Design
End Metallization (Plated)2
Packaging/Grade (C-Spec)3
0603 0805 1206 1210 1812 2220
H= High Temp (200°C)
2 Sig. Digits + Number of Zeros Use 9 for 1.0 - 9.9pF Use 8 for 0.5 - .99pF ex. 2.2pF = 229 ex. 0.5pF = 508
C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20%
8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V
G = C0G
A = N/A
C = 100% Matte Sn L = SnPb (5% min)
Blank = Bulk TU = 7" Reel Unmarked
Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination options may be available. Contact KEMET for details. 3 Additional reeling or packaging options may be available. Contact KEMET for details. 1 2
One WORLD
One Brand
One Strategy
One Focus
One Team
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
One KEMET C1001-1 • 9/14/2010
1
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
W
100% Tin or SnPb Plate
L B
T S
EIA Size Code
Metric Size Code
L Length
W Width
B Bandwidth
0603 0805 1206 1210 1812 2220
1608 2012 3216 3225 4532 5650
1.60 (.063) ± 0.15 (.006) 2.00 (.079) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 4.50 (.177) ± 0.30 (.012) 5.70 (.224) ± 0.40 (.016)
0.80 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 3.20 (.126) ± 0.30 (.012) 5.00 (.197) ± 0.40 (.016)
0.35 (.014) ± 0.15 (.006) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.60 (.024) ± 0.35 (.014) 0.60 (.024) ± 0.35 (.014)
Nickel Plate Electrodes
T Thickness
See Table 2 for Thickness
Conductive Metalization
Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability.
Environmental Compliance
RoHS PRC ( Peoples Republic of China) compliant
Electrical Parameters/Characteristics Item
Parameters/Characteristics Operating Temperature Range:
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25ºC: Insulation Resistance (IR) Limit @ 25°C: Insulation Resistance (IR) Limit @ 200°C:
-55°C to +200°C ±30PPM/ºC (up to 200ºC) 0% 250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding 50mA) 0.1% 1000 megohm microfarads or 100GΩ 10 megohm microfarads or 1GΩ
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
2
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Electrical Characteristics Delta Cap vs. Temperature (Typical)
C1210H104J1GAC - Life Test IR Distribution (Lognormal)
20
99
15
5
P e rc e n t
Delta Cap (%)
10
0 -5 -10
0 Vr
-15
100% Vr
-20
0 hrs 2000 hrs
95 90 80 70 60 50 40 30 20 10 5
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
1 0.1
1.0
10.0
100.0
25°C IR (GOhms)
Temperature (ºC)
Capacitance vs. Temperature with 25V DC Bias (Rated Voltage)
DF vs. Temperature without DC Bias.
200
1.00 200ºC C0G MLCC 100nF
200ºC C0G 100nF 25V DC
150
0.50 DF (%)
Capacitance (nF)
200ºC C0G 100nF no DC
100
0.00
50
-0.50
0
-1.00 Temperature (°C)
IR vs. Temperature with 25V DC Bias (Rated Voltage)
BME vs. PME/IR vs. Temperature with 25V DC Bias (Rated Voltage)
1.E+08
1.E+08
1.E+07
1.E+07
1.E+06
1.E+06
1.E+05
IR (MOhms)
IR (MOhms)
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
Temperature (°C)
1.E+04 1.E+03 1.E+02 1.E+01
1.E+05 1.E+04 1.E+03 PME C0G MLCC 1206/10nF
1.E+02
200ºC C0G MLCC 100nF
1.E+00
BME C0G MLCC 1206/10nF
1.E+01 200
180
160
140
120
80
100
60
40
0
20
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
-20
-40
-60
200
180
160
140
120
100
80
60
40
0
20
-20
-40
-60
Temperature (°C)
Temperature (°C)
C1001-1 • 9/14/2010
3
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 1A – (0603 - 1210 Case Sizes) 4
3
5
1
2
8
4
3
5
1
2
Voltage VDC
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DD DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DC DC DD DD DD DD DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DE DG
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DC DC DC DC DC DC DD DD
Voltage VDC
100
8
50
2
25
1
16
5
10
3
200
4
100
8
50
2
25
1
16
5
10
Voltage Code
8
4
3
5
1
2
8
4
3
5
1
Series
C0603
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC ED ED ED ED EE EC EC EC EE EE EF EC EC ED ED EB EB EB EB EB EB EB EB EB EC EE
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC ED EE EB EB EC EC ED ED ED EE EC EC
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FF FB FB FB FB FB FB FB FB FC FC FC FC FE FE FF FF FG FG FG FG FB FB FB FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FC FF FF FF FF FG FG FG FG FG FC FC FE FF FB FB FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG
25
50
100
200
10
16
25
50
100
200
M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M
16
G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G
J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J
K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
10
Cap Code
D D D D D D D D F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F
200
Cap
C C C C C C
C1210
3
16
508-759 109-249 279-519 569-919 100-130 150-240 270-360 390-510 560-910 101-181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273
C1206
4
Cap Tolerance 0.5-0.75 pF 1.0-2.4 pF 2.7-5.1 pF 5.6-9.1 pF 10-13 pF 15-24 pF 27-36 pF 39-51 pF 56-91 pF 100-180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF
C0805
8
25
C0603
Voltage Code
10
Cap
Series
Cap Code
2
8
4
3
5
1
2
8
4
3
5
1
2
C0805
C1206
C1210
UD = Under Developement © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for Order Info.
C1001-1 • 9/14/2010
4
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 1A con't – (0603 - 1210 Case Sizes) 3
5
1
2
8
4
3
5
1
10
16
25
50
100
200
10
16
25
50
100
2 200
4
200
200
8
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions M M M M M M M M M M
DG DG DG
EB EC ED EF EH EH
UD UD UD
EB EC ED EF EH EH
EB EC ED EF EH EH
EB EE EF EH EH
EE EH
FB FB FB FB FB FB FB FB FC FC FE FE FG FG FH FH
FB FB FB FB FC FE FG FH
FB FB FB FC FF FG FH FM
FB FE FF FG FH FM
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
8
25
Voltage Code
16
Voltage VDC
10
UD UD UD UD UD UD 200
K K K K K K K K K K
2
100
J J J J J J J J J J
1
50
G G G G G G G G G G
5
16
Cap
Cap Code
F F F F F F F F F F
3
25
333 473 563 683 823 104 124 154 184 224
10
33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF
C1210
4
100
100
Cap Tolerance
C1206
8
50
2
25
1
16
5
10
3
50
Voltage VDC
C0805
4 16
C0603 8
25
Series Voltage Code
10
Cap
Cap Code
4
3
5
1
2
8
4
3
5
1
2
8
4
3
5
1
2
8
4
3
5
1
2
Series
C0603
C0805
C1206
C1210
Table 1B – (1812 - 2220 Case Sizes) Cap
Cap Code
15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF
153 183 223 273 333 473 563 683 823 104 124 154 184 224 274 334 474 564 684 824
Cap
Cap Code
Series
F F F F F F F F F F F F F F F F F F F F
Voltage Code Voltage VDC Cap Tolerance G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K Voltage VDC Voltage Code
Series
C1812
M M M M M M M M M M M M M M M M M M M M
C2220
1 2 5 1 100 200 50 100 See Table 2 for Chip Thickness Dimensions GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GB GH GD GN GH GK JG
100 1
200 2
C1812
50 5
100 1
C2220
UD = Under Developement © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for Order Info.
C1001-1 • 9/14/2010
5
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 2 – Chip Thickness / Packaging Quantities Thickness Code AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF
Chip Size 01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
Thickness ± Range (mm) 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.05 0.80 ± 0.07 0.80 ± 0.10 0.80 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.25 ± 0.15 1.60 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.50 ± 0.20 1.55 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 1.85 ± 0.20 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.25 ± 0.20 2.50 ± 0.20 0.80 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.10 ± 0.15 1.15 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.70 ± 0.15 1.80 ± 0.15 2.40 ± 0.15 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.60 ± 0.20
Qty per Reel 7" Plastic
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
Qty per Reel 13" Plastic
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
Qty per Reel 7" Paper 15000 15000 10000 4000 4000 4000 4000 4000
4000
Qty per Reel 13" Paper
Qty per Bulk Cassette
50000 10000 10000 10000 10000 10000
50000 15000
10000
Package Quantity Based on Finished Chip Thickness Specifications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
6
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code
Metric Size Code
Density Level A: Maximum (Most) Land Protrusion (mm) C
Y
X
V1
Density Level B: Median (Nominal) Land Protrusion (mm) V2
C
Y
X
V1
Density Level C: Minimum (Least) Land Protrusion (mm) V2
C
Y
X
V1
V2
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
7
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL-STD-202//JESD22 High Temperature Life Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance
200°C, Rated Voltage, 2000 Hours 85°C /85%RH, Rated Voltage, 1000 Hours 85°C /85%RH, 1.5V, 1000 Hours -55°C to +200°C, 50 Cycles -55°C to +150°C, 20s transfer, 15 min dwell, 300 Cycles Cycled Temp/RH. 0V, 10 cycles @ 24 Hours each
Physical, Mechanical & Process Tests per MIL-STD 202/JIS-C-6429 Resistance to Solvents Mechanical Shock and Vibration Resistance to Soldering Heat Terminal Strength Board Flex
Include Aqueous wash chemical - OKEM Clean or equivalent Method 213: Figure 1, Condition F Method 204: 5gs for 20min, 12 cycles Condition B, no per-heat of samples, Single Wave Solder Force of 1.8 kg for 60 seconds 3mm minimum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
8
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel ®
Embossed Plastic* or Punched Paper Carrier.
T
ME
KE
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration (mm) EIA Case Size
Tape size (W)*
Pitch (P1)*
01005 - 0402
8
2
0603 - 1210
8
4
1805 - 1808
12
4
≥ 1812
12
8
KPS 1210
12
8
KPS 1812 & 2220
16
12
Array 0508 & 0612
8
4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
9
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2
T T2
ØDo
Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
Ao F Ko B1
E2
Bo
S1
W
P1 T1
Center Lines of Cavity
ØD 1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o.
Embossment For cavity size, see Note 1 Table 6
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern
Constant Dimensions — Millimeters (Inches) Tape Size
D0
8mm 12mm
1.5 +0.10/-0.0 (0.059 +0.004/-0.0)
16mm
D1 Min. Note 1 1.0 (0.039) 1.5 (0.059)
E1
P0
P2
1.75 ± 0.10 (0.069 ± 0.004)
4.0 ± 0.10 (0.157 ± 0.004)
2.0 ± 0.05 (0.079 ± 0.002)
R Ref. Note 2 25.0 (0.984) 30 (1.181)
S1 Min. Note 3
T Max.
T1 Max.
0.600 (0.024)
0.600 (0.024)
0.100 (0.004)
Variable Dimensions — Millimeters (Inches) Tape Size
Pitch
8mm
Single (4mm)
12mm
Single (4mm) & Double (8mm)
16mm
Triple (12mm)
B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476)
E2 Min.
F
P1
T2 Max
W Max
A0,B0 & K0
6.25 (0.246) 10.25 (0.404) 14.25 (0.561)
3.5 ± 0.05 (0.138 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002)
4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004)
2.5 (0.098) 4.6 (0.181) 4.6 (0.181)
8.3 (0.327) 12.3 (0.484) 16.3 (0.642)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1
High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade) Overview
KEMET’s high temperature surface mount C0G Multilayer Ceramic Capacitors (MLCCs) feature a robust, proprietary base metal dielectric system that offers industry-leading performance relative to capacitance and case size combined with capacitance stability at extreme temperatures up to +200°C. This new platform promotes downsizing opportunities of existing high temperature C0G technology, and offers replacement opportunities of existing X7R/BX/BR technologies. KEMET’s high temperature C0G dielectric features a 200°C maximum operating temperature and is considered “stable.” The
Benefits • • • • • • • • • • • • •
-55°C to +200°C operating temperature range Pb-Free and RoHS compliant EIA 0603, 0805, 1206, 1210, 1812 & 2220 case sizes DC voltage ratings of 10V, 16V, 25V, 50V, 100V and 200V Capacitance offerings ranging from 0.5pF up to 0.47μF Available capacitance tolerances of ±0.25pF, ±0.5pF, ±1%, ±2%, ±5%, ±10% or ±20% No piezoelectric noise Extremely low ESR and ESL High thermal stability High ripple current capability Preferred capacitance solution at line frequencies and into the MHz range No capacitance change with respect to applied rated DC voltage Negligible capacitance change with respect to temperature from -55°C to +200°C
Electronics Components, Assemblies & Materials Association (EIA) characterizes C0G dielectric as a Class I material. Components of this classification are temperature compensating and are suited for resonant circuit applications or those where Q and stability of capacitance characteristics are required. C0G exhibits no change in capacitance with respect to time and voltage and boasts a negligible change in capacitance with reference to ambient temperature. Capacitance change is limited to ±30ppm/ºC from -55°C to +200°C.
• No capacitance decay with time • Non-polar device, minimizing installation concerns • 100% pure matte tin-plated end metallization allowing for excellent solderability
Applications
Typical applications include critical timing, tuning, circuits requiring low loss, circuits with pulse, high current, decoupling, bypass, filtering, transient voltage suppression, blocking and energy storage for use in extreme environments such as down-hole exploration, aerospace engine compartments and geophysical probes.
Ordering Information C
1210
H
124
J
5
G
A
C
TU
Ceramic
Case Size (L" x W")
Specification/ Series
Capacitance Code (pF)
Capacitance Tolerance1
Voltage
Dielectric
Failure Rate/ Design
End Metallization (Plated)2
Packaging/Grade (C-Spec)3
0603 0805 1206 1210 1812 2220
H= High Temp (200°C)
2 Sig. Digits + Number of Zeros Use 9 for 1.0 - 9.9pF Use 8 for 0.5 - .99pF ex. 2.2pF = 229 ex. 0.5pF = 508
C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% M = ±20%
8 = 10V 4 = 16V 3 = 25V 5 = 50V 1 = 100V 2 = 200V
G = C0G
A = N/A
C = 100% Matte Sn L = SnPb (5% min)
Blank = Bulk TU = 7" Reel Unmarked
Additional capacitance tolerance offerings may be available. Contact KEMET for details. Additional termination options may be available. Contact KEMET for details. 3 Additional reeling or packaging options may be available. Contact KEMET for details. 1 2
One WORLD
One Brand
One Strategy
One Focus
One Team
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
One KEMET C1001-1 • 9/14/2010
1
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Dimensions – Millimeters (Inches)
W
100% Tin or SnPb Plate
L B
T S
EIA Size Code
Metric Size Code
L Length
W Width
B Bandwidth
0603 0805 1206 1210 1812 2220
1608 2012 3216 3225 4532 5650
1.60 (.063) ± 0.15 (.006) 2.00 (.079) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 3.20 (.126) ± 0.20 (.008) 4.50 (.177) ± 0.30 (.012) 5.70 (.224) ± 0.40 (.016)
0.80 (.032) ± 0.15 (.006) 1.25 (.049) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008) 3.20 (.126) ± 0.30 (.012) 5.00 (.197) ± 0.40 (.016)
0.35 (.014) ± 0.15 (.006) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.50 (0.02) ± 0.25 (.010) 0.60 (.024) ± 0.35 (.014) 0.60 (.024) ± 0.35 (.014)
Nickel Plate Electrodes
T Thickness
See Table 2 for Thickness
Conductive Metalization
Mounting Technique Solder Wave or Solder Reflow Solder Reflow Only
Qualification/Certification
Commercial grade products are subject to internal qualification. Details regarding test methods and conditions are referenced in Table 4, Performance and Reliability.
Environmental Compliance
RoHS PRC ( Peoples Republic of China) compliant
Electrical Parameters/Characteristics Item
Parameters/Characteristics Operating Temperature Range:
Capacitance Change with Reference to +25°C and 0 Vdc Applied (TCC): Aging Rate (Max % Cap Loss/Decade Hour): Dielectric Withstanding Voltage: Dissipation Factor (DF) Maximum Limits @ 25ºC: Insulation Resistance (IR) Limit @ 25°C: Insulation Resistance (IR) Limit @ 200°C:
-55°C to +200°C ±30PPM/ºC (up to 200ºC) 0% 250% of rated voltage (5 ± 1 seconds and charge/discharge not exceeding 50mA) 0.1% 1000 megohm microfarads or 100GΩ 10 megohm microfarads or 1GΩ
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits. Capacitance and Dissipation Factor (DF) measured under the following conditions: 1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF 120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
2
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Electrical Characteristics Delta Cap vs. Temperature (Typical)
C1210H104J1GAC - Life Test IR Distribution (Lognormal)
20
99
15
5
P e rc e n t
Delta Cap (%)
10
0 -5 -10
0 Vr
-15
100% Vr
-20
0 hrs 2000 hrs
95 90 80 70 60 50 40 30 20 10 5
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
1 0.1
1.0
10.0
100.0
25°C IR (GOhms)
Temperature (ºC)
Capacitance vs. Temperature with 25V DC Bias (Rated Voltage)
DF vs. Temperature without DC Bias.
200
1.00 200ºC C0G MLCC 100nF
200ºC C0G 100nF 25V DC
150
0.50 DF (%)
Capacitance (nF)
200ºC C0G 100nF no DC
100
0.00
50
-0.50
0
-1.00 Temperature (°C)
IR vs. Temperature with 25V DC Bias (Rated Voltage)
BME vs. PME/IR vs. Temperature with 25V DC Bias (Rated Voltage)
1.E+08
1.E+08
1.E+07
1.E+07
1.E+06
1.E+06
1.E+05
IR (MOhms)
IR (MOhms)
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
200
180
160
140
120
100
80
60
40
20
0
-20
-40
-60
Temperature (°C)
1.E+04 1.E+03 1.E+02 1.E+01
1.E+05 1.E+04 1.E+03 PME C0G MLCC 1206/10nF
1.E+02
200ºC C0G MLCC 100nF
1.E+00
BME C0G MLCC 1206/10nF
1.E+01 200
180
160
140
120
80
100
60
40
0
20
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
-20
-40
-60
200
180
160
140
120
100
80
60
40
0
20
-20
-40
-60
Temperature (°C)
Temperature (°C)
C1001-1 • 9/14/2010
3
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 1A – (0603 - 1210 Case Sizes) 4
3
5
1
2
8
4
3
5
1
2
Voltage VDC
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB CB
CB CB CB CB CB CB CB CB CB CB
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DC DC DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DD DD DC DC DC DC DD DD DD DE DE DE DE DC DC DC DC DC DC DC DC DD DD DF
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DD DC DC DD DD DD DD DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DE DG
DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DC DD DC DC DC DC DC DC DD DD
Voltage VDC
100
8
50
2
25
1
16
5
10
3
200
4
100
8
50
2
25
1
16
5
10
Voltage Code
8
4
3
5
1
2
8
4
3
5
1
Series
C0603
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC EC EC ED ED EB EB EB EC EC ED EB EB EB EB EB
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC ED ED ED ED EE EC EC EC EE EE EF EC EC ED ED EB EB EB EB EB EB EB EB EB EC EE
EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EB EC EC EC EC ED EE EB EB EC EC ED ED ED EE EC EC
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FF FB FB FB FB FB FB FB FB FC FC FC FC FE FE FF FF FG FG FG FG FB FB FB FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FF FB FB FB FB FC FC FE FF FG FG FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FC FC FC FC FF FF FF FF FG FG FG FG FG FC FC FE FF FB FB FB FB FB
FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FB FC FE FE FE FE FG FC FC FF FF FF FF FF FG FG FG
25
50
100
200
10
16
25
50
100
200
M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M M
16
G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G G
J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J J
K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K K
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions
10
Cap Code
D D D D D D D D F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F F
200
Cap
C C C C C C
C1210
3
16
508-759 109-249 279-519 569-919 100-130 150-240 270-360 390-510 560-910 101-181 201 221 241 271 301 331 361 391 431 471 511 561 621 681 751 821 911 102 112 122 132 152 162 182 202 222 242 272 302 332 362 392 432 472 512 562 622 682 752 822 912 103 123 153 183 223 273
C1206
4
Cap Tolerance 0.5-0.75 pF 1.0-2.4 pF 2.7-5.1 pF 5.6-9.1 pF 10-13 pF 15-24 pF 27-36 pF 39-51 pF 56-91 pF 100-180 pF 200 pF 220 pF 240 pF 270 pF 300 pF 330 pF 360 pF 390 pF 430 pF 470 pF 510 pF 560 pF 620 pF 680 pF 750 pF 820 pF 910 pF 1,000 pF 1,100 pF 1,200 pF 1,300 pF 1,500 pF 1,600 pF 1,800 pF 2,000 pF 2,200 pF 2,400 pF 2,700 pF 3,000 pF 3,300 pF 3,600 pF 3,900 pF 4,300 pF 4,700 pF 5,100 pF 5,600 pF 6,200 pF 6,800 pF 7,500 pF 8,200 pF 9,100 pF 10,000 pF 12,000 pF 15,000 pF 18,000 pF 22,000 pF 27,000 pF
C0805
8
25
C0603
Voltage Code
10
Cap
Series
Cap Code
2
8
4
3
5
1
2
8
4
3
5
1
2
C0805
C1206
C1210
UD = Under Developement © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for Order Info.
C1001-1 • 9/14/2010
4
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 1A con't – (0603 - 1210 Case Sizes) 3
5
1
2
8
4
3
5
1
10
16
25
50
100
200
10
16
25
50
100
2 200
4
200
200
8
Product Availability and Chip Thickness Codes - See Table 2 for Chip Thickness Dimensions M M M M M M M M M M
DG DG DG
EB EC ED EF EH EH
UD UD UD
EB EC ED EF EH EH
EB EC ED EF EH EH
EB EE EF EH EH
EE EH
FB FB FB FB FB FB FB FB FC FC FE FE FG FG FH FH
FB FB FB FB FC FE FG FH
FB FB FB FC FF FG FH FM
FB FE FF FG FH FM
50
100
200
10
16
25
50
100
200
10
16
25
50
100
200
8
25
Voltage Code
16
Voltage VDC
10
UD UD UD UD UD UD 200
K K K K K K K K K K
2
100
J J J J J J J J J J
1
50
G G G G G G G G G G
5
16
Cap
Cap Code
F F F F F F F F F F
3
25
333 473 563 683 823 104 124 154 184 224
10
33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF
C1210
4
100
100
Cap Tolerance
C1206
8
50
2
25
1
16
5
10
3
50
Voltage VDC
C0805
4 16
C0603 8
25
Series Voltage Code
10
Cap
Cap Code
4
3
5
1
2
8
4
3
5
1
2
8
4
3
5
1
2
8
4
3
5
1
2
Series
C0603
C0805
C1206
C1210
Table 1B – (1812 - 2220 Case Sizes) Cap
Cap Code
15,000 pF 18,000 pF 22,000 pF 27,000 pF 33,000 pF 47,000 pF 56,000 pF 68,000 pF 82,000 pF 0.10 uF 0.12 uF 0.15 uF 0.18 uF 0.22 uF 0.27 uF 0.33 uF 0.47 uF 0.56 uF 0.68 uF 0.82 uF
153 183 223 273 333 473 563 683 823 104 124 154 184 224 274 334 474 564 684 824
Cap
Cap Code
Series
F F F F F F F F F F F F F F F F F F F F
Voltage Code Voltage VDC Cap Tolerance G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K G J K Voltage VDC Voltage Code
Series
C1812
M M M M M M M M M M M M M M M M M M M M
C2220
1 2 5 1 100 200 50 100 See Table 2 for Chip Thickness Dimensions GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GB GD GB GH GD GN GH GK JG
100 1
200 2
C1812
50 5
100 1
C2220
UD = Under Developement © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
Roll Over for Order Info.
C1001-1 • 9/14/2010
5
Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 2 – Chip Thickness / Packaging Quantities Thickness Code AA AB BB CB CC CD DC DD DL DE DF DG DH EB EK EC EN ED EE EF EM EG EH EJ FB FC FD FE FF FG FL FO FH FP FM FJ FN FT FK FR FS PA MA NA NA LD LA LB LC GB GC GD GE GH GF GG GK GJ GN GL GM GO HB HC HD HE HF HG JB JC JD JE JF JP JG JH JO KB KC KD KE KF
Chip Size 01005 0201 0402 0603 0603 0603 0805 0805 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1220 1632 1706 1706 1808 1808 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 1825 1825 1825 2220 2220 2220 2220 2220 2220 2220 2220 2220 2225 2225 2225 2225 2225
Thickness ± Range (mm) 0.20 ± 0.02 0.30 ± 0.03 0.50 ± 0.05 0.80 ± 0.07 0.80 ± 0.10 0.80 ± 0.15 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.25 ± 0.20 0.78 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.20 ± 0.15 1.25 ± 0.15 1.60 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 0.78 ± 0.10 0.90 ± 0.10 0.95 ± 0.10 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.40 ± 0.15 1.50 ± 0.20 1.55 ± 0.15 1.60 ± 0.20 1.70 ± 0.20 1.85 ± 0.20 1.85 ± 0.20 1.90 ± 0.20 2.10 ± 0.20 2.25 ± 0.20 2.50 ± 0.20 0.80 ± 0.10 0.80 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 0.90 ± 0.10 1.40 ± 0.15 1.60 ± 0.15 2.00 ± 0.15 1.00 ± 0.10 1.10 ± 0.10 1.25 ± 0.15 1.30 ± 0.10 1.40 ± 0.15 1.50 ± 0.10 1.55 ± 0.10 1.60 ± 0.20 1.70 ± 0.15 1.70 ± 0.20 1.90 ± 0.20 2.00 ± 0.20 2.50 ± 0.20 1.10 ± 0.15 1.15 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.50 ± 0.15 1.60 ± 0.20 1.70 ± 0.15 1.80 ± 0.15 2.40 ± 0.15 1.00 ± 0.15 1.10 ± 0.15 1.30 ± 0.15 1.40 ± 0.15 1.60 ± 0.20
Qty per Reel 7" Plastic
4000 2500 2500 2500 2500 4000 2000 4000 4000 2500 2500 2500 2500 2000 2000 2000 4000 4000 4000 2500 2500 2500 2000 2000 2000 2000 2000 2000 2000 1500 2000 2000 1000 4000 4000 4000 4000 2500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 1000 500 1000 1000 1000 1000 1000
Qty per Reel 13" Plastic
10000 10000 10000 10000 10000 10000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 10000 10000 10000 10000 10000 10000 8000 8000 8000 8000 8000 8000 8000 4000 8000 8000 4000 10000 10000 10000 10000 10000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 4000 2000 4000 4000 4000 4000 4000
Qty per Reel 7" Paper 15000 15000 10000 4000 4000 4000 4000 4000
4000
Qty per Reel 13" Paper
Qty per Bulk Cassette
50000 10000 10000 10000 10000 10000
50000 15000
10000
Package Quantity Based on Finished Chip Thickness Specifications
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
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Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Soldering Profile • KEMET recommends following the guidelines outlined in IPC/JEDEC J-STD-020D.1
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC-7351 EIA Size Code
Metric Size Code
Density Level A: Maximum (Most) Land Protrusion (mm) C
Y
X
V1
Density Level B: Median (Nominal) Land Protrusion (mm) V2
C
Y
X
V1
Density Level C: Minimum (Least) Land Protrusion (mm) V2
C
Y
X
V1
V2
0603
1608
0.90
1.15
1.10
4.00
2.10
0.80
0.95
1.00
3.10
1.50
0.60
0.75
0.90
2.40
1.20
0805
2012
1.00
1.35
1.55
4.40
2.60
0.90
1.15
1.45
3.50
2.00
0.75
0.95
1.35
2.80
1.70
1206
3216
1.60
1.35
1.90
5.60
2.90
1.50
1.15
1.80
4.70
2.30
1.40
0.95
1.70
4.00
2.00
1210
3225
1.60
1.35
2.80
5.65
3.80
1.50
1.15
2.70
4.70
3.20
1.40
0.95
2.60
4.00
2.90
1808
4520
2.30
1.75
2.30
7.40
3.30
2.20
1.55
2.20
6.50
2.70
2.10
1.35
2.10
5.80
2.40
1812
4532
2.15
1.60
3.60
6.90
4.60
2.05
1.40
3.50
6.00
4.00
1.95
1.20
3.40
5.30
3.70
1825
4564
2.15
1.60
6.90
6.90
7.90
2.05
1.40
6.80
6.00
7.30
1.95
1.20
6.70
5.30
7.00
2220
5650
2.75
1.70
5.50
8.20
6.50
2.65
1.50
5.40
7.30
5.90
2.55
1.30
5.30
6.60
5.60
2225
5664
2.70
1.70
6.90
8.10
7.90
2.60
1.50
6.80
7.20
7.30
2.50
1.30
6.70
6.50
7.00
Density Level A: For low-density Product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC standard 7351 (IPC-7351).
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
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Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions Product Qualification Test Plan Reliability/Environmental Tests per MIL-STD-202//JESD22 High Temperature Life Load Humidity Low Voltage Humidity Temperature Cycling Thermal Shock Moisture Resistance
200°C, Rated Voltage, 2000 Hours 85°C /85%RH, Rated Voltage, 1000 Hours 85°C /85%RH, 1.5V, 1000 Hours -55°C to +200°C, 50 Cycles -55°C to +150°C, 20s transfer, 15 min dwell, 300 Cycles Cycled Temp/RH. 0V, 10 cycles @ 24 Hours each
Physical, Mechanical & Process Tests per MIL-STD 202/JIS-C-6429 Resistance to Solvents Mechanical Shock and Vibration Resistance to Soldering Heat Terminal Strength Board Flex
Include Aqueous wash chemical - OKEM Clean or equivalent Method 213: Figure 1, Condition F Method 204: 5gs for 20min, 12 cycles Condition B, no per-heat of samples, Single Wave Solder Force of 1.8 kg for 60 seconds 3mm minimum
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
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Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMET offers Multilayer Ceramic Chip Capacitors packaged in 8mm, 12mm and 16mm tape on 7" and 13" reels in accordance with EIA standard 481. This packaging system is compatible with all tape fed automatic pick and place systems. See Table 2 for details on reeling quantities for commercial chips.
Bar Code Label
Anti-Static Reel ®
Embossed Plastic* or Punched Paper Carrier.
T
ME
KE
Chip and KPS Orientation in Pocket (except 1825 Commercial, and 1825 & 2225 Military)
Sprocket Holes Embossment or Punched Cavity 8mm, 12mm or 16mm Carrier Tape
178mm (7.00") or 330mm (13.00")
Anti-Static Cover Tape (.10mm (.004") Max Thickness)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
Table 5 – Carrier Tape Configuration (mm) EIA Case Size
Tape size (W)*
Pitch (P1)*
01005 - 0402
8
2
0603 - 1210
8
4
1805 - 1808
12
4
≥ 1812
12
8
KPS 1210
12
8
KPS 1812 & 2220
16
12
Array 0508 & 0612
8
4
*Refer to Figure 1 for W and P1 carrier tape reference locations. *Refer to Table 6 for tolerance specifications. © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com
C1001-1 • 9/14/2010
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Surface Mount Multilayer Ceramic Chip Capacitors – High Temperature 200°C, C0G Dielectric, 10VDC-200VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions P2
T T2
ØDo
Po
[10 pitches cumulative tolerance on tape ±0.2 mm]
E1
Ao F Ko B1
E2
Bo
S1
W
P1 T1
Center Lines of Cavity
ØD 1
Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o.
Embossment For cavity size, see Note 1 Table 6
User Direction of Unreeling
Table 6 – Embossed (Plastic) Carrier Tape Dimensions Metric will govern
Constant Dimensions — Millimeters (Inches) Tape Size
D0
8mm 12mm
1.5 +0.10/-0.0 (0.059 +0.004/-0.0)
16mm
D1 Min. Note 1 1.0 (0.039) 1.5 (0.059)
E1
P0
P2
1.75 ± 0.10 (0.069 ± 0.004)
4.0 ± 0.10 (0.157 ± 0.004)
2.0 ± 0.05 (0.079 ± 0.002)
R Ref. Note 2 25.0 (0.984) 30 (1.181)
S1 Min. Note 3
T Max.
T1 Max.
0.600 (0.024)
0.600 (0.024)
0.100 (0.004)
Variable Dimensions — Millimeters (Inches) Tape Size
Pitch
8mm
Single (4mm)
12mm
Single (4mm) & Double (8mm)
16mm
Triple (12mm)
B1 Max. Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476)
E2 Min.
F
P1
T2 Max
W Max
A0,B0 & K0
6.25 (0.246) 10.25 (0.404) 14.25 (0.561)
3.5 ± 0.05 (0.138 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002) 5.5 ± 0.05 (0.217 ± 0.002)
4.0 ± 0.10 (0.157 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004) 8.0 ± 0.10 (0.315 ± 0.004)
2.5 (0.098) 4.6 (0.181) 4.6 (0.181)
8.3 (0.327) 12.3 (0.484) 16.3 (0.642)
Note 5
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape with or without components shall pass around R without damage (see Figure 5). 3. If S1
