Metal-organic thin-film encapsulation for MEMS - Semantic Scholar
IOP PUBLISHING
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
doi:10.1088/0960-1317/18/10/105002
J. Micromech. Microeng. 18 (2008) 105002 (8pp)
Metal-organic thin-film encapsulation for MEMS J Fang, J Fu and F Ayazi School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30308, USA E-mail: [email protected]
Received 27 May 2008, in final form 24 July 2008 Published 26 August 2008 Online at stacks.iop.org/JMM/18/105002 Abstract This paper demonstrates a metal-organic thin-film encapsulation technique based on the photolithography of multiple layers of positive-tone photo-definable polymer. This encapsulation process, performed at low temperatures (
JOURNAL OF MICROMECHANICS AND MICROENGINEERING
doi:10.1088/0960-1317/18/10/105002
J. Micromech. Microeng. 18 (2008) 105002 (8pp)
Metal-organic thin-film encapsulation for MEMS J Fang, J Fu and F Ayazi School of Electrical and Computer Engineering, Georgia Institute of Technology, Atlanta, GA 30308, USA E-mail: [email protected]
Received 27 May 2008, in final form 24 July 2008 Published 26 August 2008 Online at stacks.iop.org/JMM/18/105002 Abstract This paper demonstrates a metal-organic thin-film encapsulation technique based on the photolithography of multiple layers of positive-tone photo-definable polymer. This encapsulation process, performed at low temperatures (
