• How will the Japan crisis impact us this year? • Can I make better engineering material choices? • In what ways can we take weight and cost out of turbocharger systems? • What are the toughest issues faced by auto engineers?
Register Now for SPE Auto EPCON WHEN:
CALL:
Tuesday, April 26, 2011
WHERE:
MSU Management Education Center Troy, MI USA Keynote Addresses: “Global Market Outlook: Divergent Paths and Pressure Points” Mike Jackson – IHS,Global Insight
“When Materials and Applications Collide” Ashish Kulkarni – Ticona Engineering Polymers
Mike Day – DuPont Automotive
“Down-sizing engines with no performance compromise” Tom Grissom – Borg Warner, Turbocharging Systems
16 Technical Presentations: New Materials Development, Mass Reduction Technology, Application Developments
April 2011
“Top Issues Facing Automotive Engineers – 2011”
Patricia Levine at +1.248.244.8993 email
[email protected] DETROIT SECTION - SOCIETY OF PLASTICS ENGINEERS - “THE CHARTER CHAPTER”
Need Answers to Tough Questions?
Volume 55 ▲ Number 5
Tuesday, April 26, 2011
2011 AutoEPCON Conference Technical Program Highlights Dr. Norm Kakarala, Technical Chair AutoEPCON
T
he sixth annual Engineering Plastics Conference (2011 AutoEPCON) will have four sessions with presentations on 1. Mass Reduction Technologies, 2. High Heat Materials, 3. Materials Developments, and 4. Applications Developments. The one day conference will feature two concurrent sessions in the morning and two concurrent sessions in the afternoon.
Most of the automotive engineering plastics materials suppliers have joined the conference as sponsors and provide finances, exhibits, and more importantly high value technical resources.
7:00 —8:15
Registration & Continental Breakfast
8:15—8:30
Opening Remarks—Nippani Rao AutoEPCON Conference Chairman
8:30—9:15
9:15—10:00
10:00—10:30
Mike Jackson: Director of Global Forecast Services for IHS “Global Market Outlook: Divergent Paths and Pressure Points”
Dr. Ashish Kulkarni: Vice President, Research and Development, Ticona Engineering Polymers “When Materials and Applications Collide”
Mike Day: Director, Marketing and Development, DuPont Automotive “Top Issues Facing Automotive Engineers - 2011 SAE Member Survey Results”
10:30—10:45
High Heat Materials Sandra McClelland, Chevron Phillips 10:45—11:15
Break/Exhibit Review Mass Reduction Technologies Dr. Gary Kogowski, Entec Resins
More High Heat Materials Beat Back the Boundaries in Advanced Powertrains
Lightweighting the Vehicle - Achieving Mass and Weight Reduction Through a Holistic View of Design and Materials Selection
Steven Mok, DuPont Automotive Global Powertrain
11:15—11:45
11:45—12:15
Craig Dlugos, Ticona Engineering Polymers
A New Generation of Flexible Polyphthalamide (PPA) for Higher Temperature Systems
Greg Poterala, Dr. Eric Gamache, Dr. Michaela Steng, Arkema Technical Polymers
Overmold Evaluation of PPS, PPA, and PPS/PPA Alloyed Compounds J. Robert Wareham, Chevron Phillips Chemical Company LP
Rob Cunningham, Americas, LANXESS Corp.
Benefits of Using Engineering Thermoplastic Resins in Traditional Metal Applications Dave Krueger, BASF Engineering Plastics
Lunch, Sponsored by Ticona Engineering Polymers
12:15—1:15 1:15—2:00
Rising to Meet the CAFÉ Challenge; The Next Generation of Polyamide Applications
Tom Grissom: Director of Global Business Development - Turbo-charging Systems at Borg Warner “Down-sizing engines with no performance compromise”
Material Developments Jim Keeler, A. Schulman Inc. 2:00—2:30
Application Developments Dr. Suresh Shah, Delphi Corp.
PPS Compounds and Alloys for Use with Chemically Aggressive Fuels
Mass Reduction with Lower Cost Seat Construction: Blow-Molded Seat Back Technology
Carbon Nanotubes in Plastics and Elastomers for Automotive
Enhanced Performance of Surface Mount Technology (SMT) Applications with the Use of Stanyl ForTii
William E. Sattich, Ph.D., Chevron Phillips Chemical Company, L.P.
2:30—3:00
Patrick Collins, Hyperion Catalysis
Greg Costantino, DSM Engineering Plastics
Break/Exhibit Review
3:00—3:30
Next Generation Low Emission Colored Polyacetal Copolymer (POM)
Engineering Thermoplastics in Crash and Energy Management Applications
4:00—4:30
Advanced Copolymers for Automotive Lighting
New Value Propositions for Polycarbonate Glazing
4:30—5:00
DSM High Performance Engineering Plastics for Usage in Challenging Automotive Applications
Lightweight Composite Materials Developed for Light Duty Vehicles
3:30—4:00
Bruce Mulholland, Ticona Engineering Polymers
Peter Vollenberg Ph.D., SABIC Innovative Plastics
Peter Schmieg, DSM Engineering Plastics
5:00
2
Steve Rogers, Styron LLC
Matthew Marks, SABIC Innovative Plastics
Russ Craighead, SABIC Innovative Plastics
Conrad F. Zumhagen, PlastiComp, LLC.
Networking Reception, Sponsored by SPE Detroit Section & Automotive Division www.SPEdetroit.com
President’s Message Gary Kogowski, Entec Polymers
A
s we approach the end of the SPE calendar year with the ANTEC meeting, there will be a significant change in the SPE Automotive Division and SPE Detroit Section personnel. Pat Levine, our “super” administrative associate, will be retiring at the end of my term in May. Pat has provided her services to every event hosted by the division and section over the past 13 years. We wish Pat the best of luck and congratulations on her retirement. We are planning a special event for Pat’s retirement. Please consult our web site for a date and location as we move closer to Pat’s retirement date. Over the past three months Jeff Helms and I have led a committee to undertake the difficult task of finding a replacement for Pat. We interviewed many candidates for the position and our committee ultimately decided on Dawn Stephens as the most qualified person to replace Pat. Dawn was formally an executive administrative associate with Ticona. Dawn is currently training with Pat during conferences and committee meetings. Dawn’s office will be located at the American Chemistry Council office building, Troy, MI. Please feel free to stop by and say hello to Dawn. Thank you to our committee members involved in finding Pat’s replacement; Anthony Gasbarro, Bob Petrach, and Bill Windschief. The SPE AutoEPCON conference is rapidly approaching. This is a must attend conference that highlights new advances in engineering thermoplastics for automotive applications. This year we are planning sixteen technical presentations, a high tech exhibit area, and even more OEM engineers to join in networking throughout the day. The conference will be located at the MSU Conference Center, Troy, MI. The date of the conference is Tuesday, April 26. If your company would like to sponsor the AutoEPCON conference please contact Dr. Gary Kogowski at
[email protected] or (248) 797 7433.
Newsletter Sponsors A. Schulman BASF Automotive Chase Plastics Chevron Phillips Chemical DuPont Automotive Entec Polymers Ticona UniPlas M. Holland Company Bayer MaterialScience Styron LLC Maple Press
April 26, 2011 AutoEPCON
This year the SPE national ANTEC conference will be held in Boston, MA on May 1-5. This is the premier conference for plastics. Please see our web site for additional information.
May 1-5, 2011
We are always seeking new volunteers for the section. If you are interested is assisting with the newsletter, our web site, educational programs, or conferences please contact any one of our board members listed on the back page of this newsletter.
May 9, 2011
College students majoring in an area of plastics, a science, or engineering curricula related to the plastics field should consider applying for the SPE Detroit Section educational scholarship at this time. The application, scholastic requirements, and additional information are located on our web site, www.spedetroit.com.
Thank you Pat! We wish Pat the best of luck and congratulations on her retirement. 3
www.SPEdetroit.com
ANTEC 2011
BOD Dinner Meeting October 2-5, 2011 Automotive TPO Conference
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Sponsor Advertising Guides We need sponsors for the Trends & Topics Newsletter! To reach our members, SPE publishes the newsletter in dual formats- to the mailbox and to the web. To ensure your advertisement looks great in both formats, please supply ads as two separate files for both print and web. Ads can be accepted in the following formats: • Portable Document Files (PDF) preferred: For Print: Press quality or higher resolution. Fonts must be embedded. For Web: Smallest File Size or images at 96 DPI to 100 DPI. Fonts must be embedded. • Photoshop .tif Files: For Print: 175-300 DPI resolution, RGB color model. For Web: 96-100 DPI resolution, RGB color model. • JPG Files: For Print: High to Maximum Resolution, RGB color model. For Web: Low to Medium Resolution, RGB color model. • Adobe InDesignCS 5 Files: For Print: Packaged with fonts and external graphic files at 300 dpi or higher. For Web: Files can be converted in-house to web content. If any other formats are to be submitted, please contact Jim at Maple Press, 248.733.9669, fax 248.733.9625, or
[email protected] to determine if your format can be used. Early Bird sponsorship rates of 2010-2011 Newsletter Year available until July 1st 2011 for current and new sponsors. After July 1st, above Rates apply. 4
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Membership Report Bob Petrach, Safety Technology International, Inc.
M
embership numbers for SPE are not out for March yet, but I’m happy to say we are welcoming, or welcoming back 7 “new” members in February. Glenn Cannavo DSM Engineering Plastics
Timothy Geiger Detroit Testing Laboratory Inc
Matthew Kaye Clinton Aluminum and Stainless Steel
David Lawrence Milacron LLC
Angela Neagos Chris Pollack Gentex Corporation
Ermanno Ruccolo
Detroit Section member total at the end of November was up to 731 since August (728). It’s a broken record, but we are still trailing Chicago that also has grown slightly to 773. SPE as a whole also is up, in August it was 14,387, at the end of November it was 14,663. Overall, SPE membership is relatively static, showing a bit of growth but not enough for me to say it is statistically significant. As of the last report on February 28, the Detroit Section has 735 members second to Chicago with 754. Two years ago we were at 892 and #1 so like the entire region; we have some work to do. I must say I was disappointed at the turnout (