The WaferEtch® Platform Innovative Silicon &Metal Etch Solution
Innovative Silicon & Metal Etch Solution
The WaferEtch® Platform Lowest Cost of Ownership > High throughput > On-Board chemical mixing instead of expensive pre-mixed chemistry > Increased savings with up to 99.5% chemical recapture
Excellent Process Control > Integrated silicon thickness measurement and Profile Match Technology™
> Improved fine-feature etch process control with instant quench > Arm movement compensation for radial wafer non-uniformities
Chemical Management NoEfficient Cross-Contamination chemistries possible in a > Multiple WaferEtch Collection Drain captures, > The
single chamber recirculates, and isolates multiple chemistries > the No cross-contamination in same chamber.
> Each chemistry is isolated with its own dispense arm.
Veeco’s single wafer wet etch technology enables uniform selective etching on multiple process levels, free of cross-contamination. Etch uniformity better than 1% is routine. Whether for advanced packaging or BEOL Veeco’s single wafer wetsystems etch technology enables uniformyield selective etching on lowest multiple process levels,cost. free wet etches, WaterEtch accomplish the highest process at the manufacturing of cross-contamination. better than 1% isbackside, routine. Whether for advanced packagingsystems or BEOL When etch structures orEtch filmsuniformity are needed in the active, and/or bevel areas, WaferEtch wet systems accomplish the highest yield process at the lowest manufacturing cost. are aetches, proven WaterEtch technical solution. When etch structures or films are needed in the active, backside, and/or bevel areas, WaferEtch systems are a proven technical solution.
Unique TSV Reveal Process For low-cost TSV reveal processing, the WaferEtch tool is specifically configured to address wafer thinning to Unique TSV Reveal Process reveal the interconnects. This has become a critical step in the manufacture of 2.5D and 3D-IC packaging for
For low-cost TSVand reveal WaferEtch tool isfour specifically configured to address thinning to replaces process control costprocessing, reduction. the WaferEtch tools required for the dry-etchwafer approach: CMP, reveal the interconnects. Thismeasurement has become aand critical in theIntegration manufacture 2.5D andmeasurement 3D-IC packaging for plasma measurement and waferstep cleaning. etch, silicon thickness wafer cleaning. of aofthickness sensor process control and Match cost reduction. WaferEtch replaces four toolscontrol required the dry-etch approach: CMP, Profile Technology in the etch system provides closed-loop control of the waferprocess. etching and Veeco's Veeco's Profile Match Technology provides closed-loop offorthe wafer etching plasma etch, silicon thickness and wafer cleaning. Integration ofmore a thickness measurement sensor process. WaferEtch achieves ameasurement significant reduction CoO,making making 3D economically feasible. WaferEtch achieves a significant reduction in in CoO, 3D TSVs TSVs more economically feasible. and Veeco's Profile Match Technology in the etch system provides closed-loop control of the wafer etching process. WaferEtch achieves a significant reduction in CoO, making 3D TSVs more economically feasible.
TOP VIEW AFTER TSVs REVEALED
SEM CROSS-SECTION AFTER TSVs REVEALED
TOP VIEW AFTER TSVs REVEALED
SEM CROSS-SECTION AFTER TSVs REVEALED
SILICON THICKNESS POST GRIND VS. POST WET ETCH, WITH TSV DEPTH DISPLAYED
Additional Etch Processes, Ideal for WaferEtch
SILICON THICKNESS POST GRIND VS. POST WET ETCH, WITH TSV DEPTH DISPLAYED
Additional Etch Processes, Ideal forIdeal WaferEtch Additional Etch Processes, for WaferEtch UBM/RDL Wafer Thinning and Stress Relief UBM/RDL Etch Wafer Thinning and Stress Relief Relief UBM/RDL Etch Wafer Thinning and Stress
TOP VIEW–AFTER UBM ETCH
BUMP CROSS-SECTION
TOP VIEW–AFTER UBM ETCH
BUMP CROSS-SECTION
HIGHLY REPEATABLE PROCESS HIGHLY REPEATABLE PROCESS
PROPRIETARY ENDPOINTING–UBM ETCH
AFM IMAGES BEFORE AND AFTER WAFER THINNING–7X LOWER ROUGHNESS
PROPRIETARY ENDPOINTING–UBM ETCH
AFM IMAGES BEFORE AND AFTER WAFER THINNING–7X LOWER ROUGHNESS
Find out more at www.veeco.com or call 1.888.24.VEECO Find out more at www.veeco.com or callVeeco 1.888.24.VEECO ©2016 Instruments, Inc. ©2016 Veeco Instruments, Inc.
Veeco Precision Surface Processing 185 Gibraltar Road Horsham, PA 19044 USA Veeco Precision Surface Processing +1 215-328-0700 185 Gibraltar Road Horsham, PA 19044 USA +1 215-328-0700
The WaferEtch® Platform Lowest Cost of Ownership > High throughput > On-Board chemical mixing instead of expensive pre-mixed chemistry > Increased savings with up to 99.5% chemical recapture
Excellent Process Control > Integrated silicon thickness measurement and Profile Match Technology™
> Improved fine-feature etch process control with instant quench > Arm movement compensation for radial wafer non-uniformities
Chemical Management NoEfficient Cross-Contamination chemistries possible in a > Multiple WaferEtch Collection Drain captures, > The
single chamber recirculates, and isolates multiple chemistries > the No cross-contamination in same chamber.
> Each chemistry is isolated with its own dispense arm.
Veeco’s single wafer wet etch technology enables uniform selective etching on multiple process levels, free of cross-contamination. Etch uniformity better than 1% is routine. Whether for advanced packaging or BEOL Veeco’s single wafer wetsystems etch technology enables uniformyield selective etching on lowest multiple process levels,cost. free wet etches, WaterEtch accomplish the highest process at the manufacturing of cross-contamination. better than 1% isbackside, routine. Whether for advanced packagingsystems or BEOL When etch structures orEtch filmsuniformity are needed in the active, and/or bevel areas, WaferEtch wet systems accomplish the highest yield process at the lowest manufacturing cost. are aetches, proven WaterEtch technical solution. When etch structures or films are needed in the active, backside, and/or bevel areas, WaferEtch systems are a proven technical solution.
Unique TSV Reveal Process For low-cost TSV reveal processing, the WaferEtch tool is specifically configured to address wafer thinning to Unique TSV Reveal Process reveal the interconnects. This has become a critical step in the manufacture of 2.5D and 3D-IC packaging for
For low-cost TSVand reveal WaferEtch tool isfour specifically configured to address thinning to replaces process control costprocessing, reduction. the WaferEtch tools required for the dry-etchwafer approach: CMP, reveal the interconnects. Thismeasurement has become aand critical in theIntegration manufacture 2.5D andmeasurement 3D-IC packaging for plasma measurement and waferstep cleaning. etch, silicon thickness wafer cleaning. of aofthickness sensor process control and Match cost reduction. WaferEtch replaces four toolscontrol required the dry-etch approach: CMP, Profile Technology in the etch system provides closed-loop control of the waferprocess. etching and Veeco's Veeco's Profile Match Technology provides closed-loop offorthe wafer etching plasma etch, silicon thickness and wafer cleaning. Integration ofmore a thickness measurement sensor process. WaferEtch achieves ameasurement significant reduction CoO,making making 3D economically feasible. WaferEtch achieves a significant reduction in in CoO, 3D TSVs TSVs more economically feasible. and Veeco's Profile Match Technology in the etch system provides closed-loop control of the wafer etching process. WaferEtch achieves a significant reduction in CoO, making 3D TSVs more economically feasible.
TOP VIEW AFTER TSVs REVEALED
SEM CROSS-SECTION AFTER TSVs REVEALED
TOP VIEW AFTER TSVs REVEALED
SEM CROSS-SECTION AFTER TSVs REVEALED
SILICON THICKNESS POST GRIND VS. POST WET ETCH, WITH TSV DEPTH DISPLAYED
Additional Etch Processes, Ideal for WaferEtch
SILICON THICKNESS POST GRIND VS. POST WET ETCH, WITH TSV DEPTH DISPLAYED
Additional Etch Processes, Ideal forIdeal WaferEtch Additional Etch Processes, for WaferEtch UBM/RDL Wafer Thinning and Stress Relief UBM/RDL Etch Wafer Thinning and Stress Relief Relief UBM/RDL Etch Wafer Thinning and Stress
TOP VIEW–AFTER UBM ETCH
BUMP CROSS-SECTION
TOP VIEW–AFTER UBM ETCH
BUMP CROSS-SECTION
HIGHLY REPEATABLE PROCESS HIGHLY REPEATABLE PROCESS
PROPRIETARY ENDPOINTING–UBM ETCH
AFM IMAGES BEFORE AND AFTER WAFER THINNING–7X LOWER ROUGHNESS
PROPRIETARY ENDPOINTING–UBM ETCH
AFM IMAGES BEFORE AND AFTER WAFER THINNING–7X LOWER ROUGHNESS
Find out more at www.veeco.com or call 1.888.24.VEECO Find out more at www.veeco.com or callVeeco 1.888.24.VEECO ©2016 Instruments, Inc. ©2016 Veeco Instruments, Inc.
Veeco Precision Surface Processing 185 Gibraltar Road Horsham, PA 19044 USA Veeco Precision Surface Processing +1 215-328-0700 185 Gibraltar Road Horsham, PA 19044 USA +1 215-328-0700
