Solstice Plating Introduction (Web Version)
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SOLSTICE Advanced Electropla/ng Tools for the Rest of Us
1
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Addressing a major problem in the equipment industry… The big equipment manufacturers focus on big leading-‐edge 300mm tools — which are too expensive for many users Many users just need a good solid tool that’s designed for ≤200mm substrates… At a much more affordable price!
2
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
New SolsHce plaHng systems address those needs specifically U/lizing today s advanced technology Addressing 200mm and smaller substrates And with significantly reduced pricing — Half compared with the Big Guys!
3
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Three complementary SolsHce tools:
Model LT for Development
Model S4 for ProducHon
Model S8 for Volume ProducHon
2 Chambers
4 Chambers
4-‐6-‐8 Chambers
4
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce LT — A powerful plaHng development tool Manual wafer load/unload Automated recipe execu/on 4-‐inch to 8-‐inch wafer capability One or two chambers and chemistries Chambers and soWware match S4/S8
5
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce S4 and S8 — Automated volume producHon tools CasseZe-‐to-‐casseZe automa/on Up to 75wph throughput Automated recipe execu/on Up to 8 chambers and chemistries 4-‐inch to 8-‐inch wafer capability
6
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce gives major advantages over wet bench plaHng BeZer wafer uniformity Less wafer-‐to-‐wafer varia/on Reduced scrap Less human exposure to chemicals Faster pla/ng rates Higher yields
7
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce serves many market sectors that use ≤200mm substrates MEMS
Photonics
LEDs
Wafer Level Packaging
Sensors
Analog / Discrete
Power
Automo/ve
RF
And more…
8
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Applying today s technology to today s process needs Ni, Cu, Au, Sn, Ag, Alloys Cu RDL, Cu Pillar, Cu Damascene TSV Fill, Cu or NiW Au Pads and Contacts, Cyanide or Sulfite Lead-‐free Solders Indium, Permalloy, Exo/cs Electroly/c, Electroless and Anodiza/on
9
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce is Demonstrated at ClassOne s world-‐class applicaHons and product development lab
10
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Designed and driven by a world-‐class team of wet processing professionals
Kevin Witt VP, Technology
Dean Campbell VP, Manufacturing
Tim McGlenn VP, Development
11+ yrs wet processing
20+ yrs wet processing
26+ yrs wet processing
Win Carpenter VP, Sales
Byron Exarcos President
27+ yrs wet processing
11+ yrs wet processing
11
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Backed by world-‐wide sales and support Kalispell, MT
London, UK Shanghai, China
Atlanta, GA
Israel Singapore
12
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce: A unique new class of plaHng tools that deliver… The performance you need At a price you can afford!
13
SOLSTICE Advanced Electropla/ng Tools for the Rest of Us
1
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Addressing a major problem in the equipment industry… The big equipment manufacturers focus on big leading-‐edge 300mm tools — which are too expensive for many users Many users just need a good solid tool that’s designed for ≤200mm substrates… At a much more affordable price!
2
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
New SolsHce plaHng systems address those needs specifically U/lizing today s advanced technology Addressing 200mm and smaller substrates And with significantly reduced pricing — Half compared with the Big Guys!
3
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Three complementary SolsHce tools:
Model LT for Development
Model S4 for ProducHon
Model S8 for Volume ProducHon
2 Chambers
4 Chambers
4-‐6-‐8 Chambers
4
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce LT — A powerful plaHng development tool Manual wafer load/unload Automated recipe execu/on 4-‐inch to 8-‐inch wafer capability One or two chambers and chemistries Chambers and soWware match S4/S8
5
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce S4 and S8 — Automated volume producHon tools CasseZe-‐to-‐casseZe automa/on Up to 75wph throughput Automated recipe execu/on Up to 8 chambers and chemistries 4-‐inch to 8-‐inch wafer capability
6
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce gives major advantages over wet bench plaHng BeZer wafer uniformity Less wafer-‐to-‐wafer varia/on Reduced scrap Less human exposure to chemicals Faster pla/ng rates Higher yields
7
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce serves many market sectors that use ≤200mm substrates MEMS
Photonics
LEDs
Wafer Level Packaging
Sensors
Analog / Discrete
Power
Automo/ve
RF
And more…
8
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Applying today s technology to today s process needs Ni, Cu, Au, Sn, Ag, Alloys Cu RDL, Cu Pillar, Cu Damascene TSV Fill, Cu or NiW Au Pads and Contacts, Cyanide or Sulfite Lead-‐free Solders Indium, Permalloy, Exo/cs Electroly/c, Electroless and Anodiza/on
9
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce is Demonstrated at ClassOne s world-‐class applicaHons and product development lab
10
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Designed and driven by a world-‐class team of wet processing professionals
Kevin Witt VP, Technology
Dean Campbell VP, Manufacturing
Tim McGlenn VP, Development
11+ yrs wet processing
20+ yrs wet processing
26+ yrs wet processing
Win Carpenter VP, Sales
Byron Exarcos President
27+ yrs wet processing
11+ yrs wet processing
11
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
Backed by world-‐wide sales and support Kalispell, MT
London, UK Shanghai, China
Atlanta, GA
Israel Singapore
12
C l a s s O n e T e c h n o l o g y : A d v a n c e d W e t P r o c e s s i n g E q u i p m e n t f o r t h e R e s t o f U s
SolsHce: A unique new class of plaHng tools that deliver… The performance you need At a price you can afford!
13
