SD Series 450W Discrete Unidirectional TVS Diode - Octopart
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
SD Series 450W Discrete Unidirectional TVS Diode
RoHS Pb GREEN
The SD series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD series can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A (SD05) of 8/20μs induced surge current (IEC61000-4-5) with very low clamping voltages.
Pinout and Functional Block Diagram
1
2
Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
• Low clamping voltage
• EFT, IEC61000-4-4, 40A (5/50ns)
• Small SOD323 package fits 0805 footprints
• Lightning, IEC61000-4-5, 30A (tP=8/20μs, SD05)
• AEC-Q101 qualified
Applications • Switches / Buttons • Test Equipment / Instrumentation • Point-of-Sale Terminals • Medical Equipment
Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
• Low leakage current
• Notebooks / Desktops / Servers • Computer Peripherals • Automotive Electronics
SD
Description
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Absolute Maximum Ratings Symbol
Parameter
Value
Units
450
W
Operating Temperature
-40 to 125
°C
Storage Temperature
-55 to 150
°C
Ppk
Peak Pulse Power (tp=8/20μs)
TOP TSTOR Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Storage Temperature Range
SD05 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
ILEAK
VR=5V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
9.8
V
IPP=10A, tP=8/20μs, Fwd
13.0
V
Reverse Voltage Drop Leakage Current Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance
RDYN
TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
VESD CD
1
Min
Typ
Max
Units
5.0
V
6.0
V
0.22
Ω 30.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
350
pF
Max
Units
12.0
V
SD12 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
ILEAK
VR=12V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
18.5
V
IPP=10A, tP=8/20μs, Fwd
22.5
V
Reverse Voltage Drop Leakage Current Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance
1
RDYN Ipp VESD CD-GND
Test Conditions
Min
Typ
13.3
TLP, tp=100ns, I/O to Ground
V
0.29
tp=8/20µs
Ω 17.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
150
pF
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
SD15 Electrical Characteristics (TOP=25ºC) Symbol
Test Conditions
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
Max
Units
15.0
V
16.7
V
VR=15V
1.0
μA
24.0
V
IPP=10A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
30.0 0.34
V Ω
12.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
100
pF
Max
Units
24.0
V
SD24 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
26.7
V
VR=24V
1.0
μA
36.0
V
IPP=5A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
42.0 0.49 7.0
IEC61000-4-2 (Contact Discharge)
±30
IEC61000-4-2 (Air Discharge)
±30
V Ω A kV kV
Reverse Bias=0V, f=1MHz
65
pF
Max
Units
SD36 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
40.0
V V
1.0
μA
52.0
V
IPP=4A, tp=8/20µs, Fwd
Ipp
tp=8/20µs
62.0 0.61
±30
IEC61000-4-2 (Air Discharge)
±30
Reverse Bias=0V, f=1MHz
1. Parameter is guaranteed by design and/or device characterization. 2.Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
V Ω
5.0
IEC61000-4-2 (Contact Discharge)
Note:
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
36.0
VR=36V
TLP, tp=100ns, I/O to Ground
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
A kV kV
50
pF
SD
Parameter Reverse Standoff Voltage
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Non-Repetitive Peak Pulse Power vs. Pulse Time
Capacitance vs. Bias 160
10
Capacitance (pF)
Peak Pulse Power - P
pk (kW)
140 1
0.1
120
SD05
100 80 60
SD12
40
SD15
20 0.01 0.1
1
10
100
3
6
9
12
15
18
21
24
27
30
33
36
Pulse Waveform
110
110%
100
100%
90
90%
80
80%
Percent of IPP
70 60 50 40 30
70% 60% 50% 40% 30%
20
20%
10 0
0
SD36 SD36C
Bias Voltage (V)
Power Derating Curve
% of Rated Power I PP
0
1000
Pulse Duration - t p (µs)
SD24 SD24C
10%
0
25
50
75
100
125
150
Ambient Temperature - T A (oC)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
SD05 Transmission Line Pulsing(TLP) Plot
SD12 Transmission Line Pulsing(TLP) Plot
22
22
20
20
18
18
16
16
TLP Current (A)
TLP Current (A)
0%
14 12 10
14 12 10
8
8
6
6
4
4
2
2 0
0 0
2
4
6
8
TLP Voltage (V)
10
12
14
0
2
4
6
8
10
12
14
16
18
20
22
TLP Voltage (V)
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
SD24 Transmission Line Pulsing(TLP) Plot
22
22
20
20
18
18
16
16
14 12 10
14
SD
TLP Current (A)
TLP Current (A)
SD15 Transmission Line Pulsing(TLP) Plot
12 10
8
8
6
6
4
4
2
2 0
0 0
2
4
6
8
10
12
14
16
18
20
22
24
26
0
28
5
10
15
20
25
30
35
40
TLP Voltage (V)
TLP Voltage (V)
SD36 Transmission Line Pulsing(TLP) Plot 22 20 18
TLP Current (A)
16 14 12 10 8 6 4 2 0 0
5
10
15
20
25
30
35
40
45
50
55
60
TLP Voltage (V)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
tP
TP Temperature
Reflow Condition
Critical Zone TL to TP
Ramp-up
TL TS(max)
tL Ramp-do Ramp-down Preheat
TS(min)
25
tS time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Product Characteristics
Ordering Information
Lead Plating
Matte Tin
Part Number
Package
Marking
Min. Order Qty.
Lead Material
Copper Alloy
SD05-01FTG
SOD323
g
3000
Lead Coplanarity
0.0004 inches (0.102mm)
SD12-01FTG
SOD323
g1
3000
Substrate material
Silicon
SD15-01FTG
SOD323
g2
3000
Body Material
Molded Epoxy
SD24-01FTG
SOD323
g3
3000
Flammability
UL 94 V-0
SD36-01FTG
SOD323
g4
3000
Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.
Part Marking System
Part Numbering System
SD** – 01 F T G G= Green
g*
TVS Diode Arrays (SPA® Diodes )
T= Tape & Reel
Voltage Number of Channels
Blank: SD05-01FTG 1: SD12-01FTG 2: SD15-01FTG 3: SD24-01FTG 4: SD36-01FTG
Package F: SOD323
Package Dimensions -SOD323 E
A1
SOD323
A2
Symbol
Millimeters Min
D
b
A L1 L
Recommended Solder Pad 1.79
0.49 0.45
c
0.2
L
1.14 2.76
Max 0.039
A1
0.00
0.10
0.000
0.004
A2
0.80
0.90
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.08
0.15
0.003
0.006
D
1.20
1.40
0.047
0.055
E
1.60
1.80
0.063
0.071
E1
2.50
2.70
0.098
0.106
0.475 REF
L
2.28
Inches Min
1.00
A
E1
Max
0.019 REF
L1
0.25
0.40
0.010
0.016
Ø
0º
8º
0º
8º
Unit: mm
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Embossed Carrier Tape & Reel Specification — SOD323 2.00
4.00
ø1.50
ø178
6
R7
5.
R2
12.3
0
1.75
8.
3000 2500 2000
SD
54.4
500
.5
1000
5.6
R6
A
8.00
A
B
3.50
1500
R2
12.3
4.00
B 9.5
0.254
1.25
2.90
1.46
Cover Tape
A-A
B-B
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
SD Series 450W Discrete Unidirectional TVS Diode
RoHS Pb GREEN
The SD series is designed to replace multilayer varistors (MLVs) in electronic equipment for low speed and DC applications. It will protect any sensitive equipment from damage due to electrostatic discharge (ESD) and other transient events. The SD series can safely absorb repetitive ESD strikes at ±30kV (contact discharge, IEC 61000-4-2) without performance degradation and safely dissipate 30A (SD05) of 8/20μs induced surge current (IEC61000-4-5) with very low clamping voltages.
Pinout and Functional Block Diagram
1
2
Features • ESD, IEC61000-4-2, ±30kV contact, ±30kV air
• Low clamping voltage
• EFT, IEC61000-4-4, 40A (5/50ns)
• Small SOD323 package fits 0805 footprints
• Lightning, IEC61000-4-5, 30A (tP=8/20μs, SD05)
• AEC-Q101 qualified
Applications • Switches / Buttons • Test Equipment / Instrumentation • Point-of-Sale Terminals • Medical Equipment
Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. © 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
• Low leakage current
• Notebooks / Desktops / Servers • Computer Peripherals • Automotive Electronics
SD
Description
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Absolute Maximum Ratings Symbol
Parameter
Value
Units
450
W
Operating Temperature
-40 to 125
°C
Storage Temperature
-55 to 150
°C
Ppk
Peak Pulse Power (tp=8/20μs)
TOP TSTOR Notes:
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Thermal Information Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
Maximum Lead Temperature (Soldering 20-40s)
260
°C
Storage Temperature Range
SD05 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
ILEAK
VR=5V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
9.8
V
IPP=10A, tP=8/20μs, Fwd
13.0
V
Reverse Voltage Drop Leakage Current Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance
RDYN
TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
VESD CD
1
Min
Typ
Max
Units
5.0
V
6.0
V
0.22
Ω 30.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
350
pF
Max
Units
12.0
V
SD12 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
ILEAK
VR=12V
1.0
μA
IPP=1A, tp=8/20µs, Fwd
18.5
V
IPP=10A, tP=8/20μs, Fwd
22.5
V
Reverse Voltage Drop Leakage Current Clamp Voltage1
VC
Dynamic Resistance
2
Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance
1
RDYN Ipp VESD CD-GND
Test Conditions
Min
Typ
13.3
TLP, tp=100ns, I/O to Ground
V
0.29
tp=8/20µs
Ω 17.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
150
pF
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
SD15 Electrical Characteristics (TOP=25ºC) Symbol
Test Conditions
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
Max
Units
15.0
V
16.7
V
VR=15V
1.0
μA
24.0
V
IPP=10A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
30.0 0.34
V Ω
12.0
A
IEC61000-4-2 (Contact Discharge)
±30
kV
IEC61000-4-2 (Air Discharge)
±30
kV
Reverse Bias=0V, f=1MHz
100
pF
Max
Units
24.0
V
SD24 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
26.7
V
VR=24V
1.0
μA
36.0
V
IPP=5A, tp=8/20µs, Fwd TLP, tp=100ns, I/O to Ground
Ipp
tp=8/20µs
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
42.0 0.49 7.0
IEC61000-4-2 (Contact Discharge)
±30
IEC61000-4-2 (Air Discharge)
±30
V Ω A kV kV
Reverse Bias=0V, f=1MHz
65
pF
Max
Units
SD36 Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Test Conditions
Reverse Standoff Voltage
VRWM
IR≤1μA
VR
IR=1mA
Reverse Voltage Drop Leakage Current Clamp Voltage1 Dynamic Resistance2 Peak Pulse Current ESD Withstand Voltage1 Diode Capacitance1
ILEAK VC
40.0
V V
1.0
μA
52.0
V
IPP=4A, tp=8/20µs, Fwd
Ipp
tp=8/20µs
62.0 0.61
±30
IEC61000-4-2 (Air Discharge)
±30
Reverse Bias=0V, f=1MHz
1. Parameter is guaranteed by design and/or device characterization. 2.Transmission Line Pulse (TLP) with 100ns width and 200ps rise time.
V Ω
5.0
IEC61000-4-2 (Contact Discharge)
Note:
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
36.0
VR=36V
TLP, tp=100ns, I/O to Ground
CI/O-GND
Typ
IPP=1A, tp=8/20µs, Fwd
RDYN
VESD
Min
A kV kV
50
pF
SD
Parameter Reverse Standoff Voltage
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Non-Repetitive Peak Pulse Power vs. Pulse Time
Capacitance vs. Bias 160
10
Capacitance (pF)
Peak Pulse Power - P
pk (kW)
140 1
0.1
120
SD05
100 80 60
SD12
40
SD15
20 0.01 0.1
1
10
100
3
6
9
12
15
18
21
24
27
30
33
36
Pulse Waveform
110
110%
100
100%
90
90%
80
80%
Percent of IPP
70 60 50 40 30
70% 60% 50% 40% 30%
20
20%
10 0
0
SD36 SD36C
Bias Voltage (V)
Power Derating Curve
% of Rated Power I PP
0
1000
Pulse Duration - t p (µs)
SD24 SD24C
10%
0
25
50
75
100
125
150
Ambient Temperature - T A (oC)
0.0
5.0
10.0
15.0
20.0
25.0
30.0
Time (μs)
SD05 Transmission Line Pulsing(TLP) Plot
SD12 Transmission Line Pulsing(TLP) Plot
22
22
20
20
18
18
16
16
TLP Current (A)
TLP Current (A)
0%
14 12 10
14 12 10
8
8
6
6
4
4
2
2 0
0 0
2
4
6
8
TLP Voltage (V)
10
12
14
0
2
4
6
8
10
12
14
16
18
20
22
TLP Voltage (V)
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
SD24 Transmission Line Pulsing(TLP) Plot
22
22
20
20
18
18
16
16
14 12 10
14
SD
TLP Current (A)
TLP Current (A)
SD15 Transmission Line Pulsing(TLP) Plot
12 10
8
8
6
6
4
4
2
2 0
0 0
2
4
6
8
10
12
14
16
18
20
22
24
26
0
28
5
10
15
20
25
30
35
40
TLP Voltage (V)
TLP Voltage (V)
SD36 Transmission Line Pulsing(TLP) Plot 22 20 18
TLP Current (A)
16 14 12 10 8 6 4 2 0 0
5
10
15
20
25
30
35
40
45
50
55
60
TLP Voltage (V)
Soldering Parameters
Pre Heat
Pb – Free assembly
- Temperature Min (Ts(min))
150°C
- Temperature Max (Ts(max))
200°C
- Time (min to max) (ts)
60 – 180 secs
Average ramp up rate (Liquidus) Temp (TL) to peak
3°C/second max
TS(max) to TL - Ramp-up Rate
3°C/second max
Reflow
- Temperature (TL) (Liquidus)
217°C
- Temperature (tL)
60 – 150 seconds
Peak Temperature (TP)
260+0/-5 °C
Time within 5°C of actual peak Temperature (tp)
20 – 40 seconds
Ramp-down Rate
6°C/second max
Time 25°C to peak Temperature (TP)
8 minutes Max.
Do not exceed
260°C
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
tP
TP Temperature
Reflow Condition
Critical Zone TL to TP
Ramp-up
TL TS(max)
tL Ramp-do Ramp-down Preheat
TS(min)
25
tS time to peak temperature
Time
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Product Characteristics
Ordering Information
Lead Plating
Matte Tin
Part Number
Package
Marking
Min. Order Qty.
Lead Material
Copper Alloy
SD05-01FTG
SOD323
g
3000
Lead Coplanarity
0.0004 inches (0.102mm)
SD12-01FTG
SOD323
g1
3000
Substrate material
Silicon
SD15-01FTG
SOD323
g2
3000
Body Material
Molded Epoxy
SD24-01FTG
SOD323
g3
3000
Flammability
UL 94 V-0
SD36-01FTG
SOD323
g4
3000
Notes : 1. All dimensions are in millimeters 2. Dimensions include solder plating. 3. Dimensions are exclusive of mold flash & metal burr. 4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form. 5. Package surface matte finish VDI 11-13.
Part Marking System
Part Numbering System
SD** – 01 F T G G= Green
g*
TVS Diode Arrays (SPA® Diodes )
T= Tape & Reel
Voltage Number of Channels
Blank: SD05-01FTG 1: SD12-01FTG 2: SD15-01FTG 3: SD24-01FTG 4: SD36-01FTG
Package F: SOD323
Package Dimensions -SOD323 E
A1
SOD323
A2
Symbol
Millimeters Min
D
b
A L1 L
Recommended Solder Pad 1.79
0.49 0.45
c
0.2
L
1.14 2.76
Max 0.039
A1
0.00
0.10
0.000
0.004
A2
0.80
0.90
0.031
0.035
b
0.25
0.35
0.010
0.014
c
0.08
0.15
0.003
0.006
D
1.20
1.40
0.047
0.055
E
1.60
1.80
0.063
0.071
E1
2.50
2.70
0.098
0.106
0.475 REF
L
2.28
Inches Min
1.00
A
E1
Max
0.019 REF
L1
0.25
0.40
0.010
0.016
Ø
0º
8º
0º
8º
Unit: mm
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
TVS Diode Arrays (SPA® Diodes) General Purpose ESD Protection - SD Series
Embossed Carrier Tape & Reel Specification — SOD323 2.00
4.00
ø1.50
ø178
6
R7
5.
R2
12.3
0
1.75
8.
3000 2500 2000
SD
54.4
500
.5
1000
5.6
R6
A
8.00
A
B
3.50
1500
R2
12.3
4.00
B 9.5
0.254
1.25
2.90
1.46
Cover Tape
A-A
B-B
© 2014 Littelfuse, Inc. Specifications are subject to change without notice. Revised: 05/05/14
