SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP3022 Series
SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
RoHS Pb GREEN
Description The SP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HDMI,USB2.0, USB3.0 and eSATA. Pinout Features
0201 Flipchip
1
2
SOD882
1
2
t4QBDFFGmDJFOUBOE 0402 footprint
t&'5 *&$ " (5/50ns)
t&YUSFNFMZMPXEZOBNJD resistance (0.7Ω TYP)
t-JHIUOJOHQSPUFDUJPO IEC61000-4-5, 3A (tp=8/20μs)
t"&$2RVBMJmFE (SOD882 package)
t-PXMFBLBHFDVSSFOUPG 100nA at 5.3V (MAX)
t-PXDBQBDJUBODFPG Q'!7R=0V (TYP)
"&$2RVBMJmFE
Functional Block Diagram
1
t&4%QSPUFDUJPOPGL7 contact discharge, ±30kV air discharge, (IEC61000-4-2)
Applications
2
t64#64#.)-
t4NBSU1IPOFT
t.*1*$BNFSBBOE%JTQMBZ
t&YUFSOBM4UPSBHF
t)%.* %JTQMBZ1PSU 1.3, eSATA
t6MUSBCPPLT /PUFCPPLT
t4FU5PQ#PYFT (BNF Consoles
t)JHI4QFFE4FSJBM Interfaces
t5BCMFUT F3FBEFST
-JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/14/14
SP3022 Series 1 506
TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP3022 Series
Thermal Information
Absolute Maximum Ratings Symbol
Parameter
PPK
Value
Peak Pulse Power (tP=8/20μs)
IPP
Peak Current (tp=8/20μs)
TOP
Operating Temperature
Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
.BYJNVN-FBE5FNQFSBUVSF (Soldering 20-40s)
260
°C
Units
20
Storage Temperature Range
W
3.0
A
-40 to 125
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
Min
VRWM 1R=1mA
6.8
Reverse Breakdown Voltage
VBR
3FWFSTF-FBLBHF$VSSFOU
I-&",
VR=5.3V
VC
IPP=1A, tp T 'XE
Dynamic Resistance2
R%:/
5-1 UQ OT *0UP(/%
ESD Withstand Voltage1
VESD
Clamp Voltage1
Diode Capacitance
Typ
1
7.8
SP3022 Series 0.35pF 20kV Bidirectional Discrete TVS
RoHS Pb GREEN
Description The SP3022 includes back-to-back TVS diodes fabricated in a proprietary silicon avalanche technology to provide protection for electronic equipment that may experience destructive electrostatic discharges (ESD). These robust diodes can safely absorb repetitive ESD strikes up to the maximum level specified in the IEC61000-4-2 international standard (±20kV contact discharge) without performance degradation. The back-to-back configuration provides symmetrical ESD protection for data lines when AC signals are present and the low loading capacitance makes it ideal for protecting high speed data lines such as HDMI,USB2.0, USB3.0 and eSATA. Pinout Features
0201 Flipchip
1
2
SOD882
1
2
t4QBDFFGmDJFOUBOE 0402 footprint
t&'5 *&$ " (5/50ns)
t&YUSFNFMZMPXEZOBNJD resistance (0.7Ω TYP)
t-JHIUOJOHQSPUFDUJPO IEC61000-4-5, 3A (tp=8/20μs)
t"&$2RVBMJmFE (SOD882 package)
t-PXMFBLBHFDVSSFOUPG 100nA at 5.3V (MAX)
t-PXDBQBDJUBODFPG Q'!7R=0V (TYP)
"&$2RVBMJmFE
Functional Block Diagram
1
t&4%QSPUFDUJPOPGL7 contact discharge, ±30kV air discharge, (IEC61000-4-2)
Applications
2
t64#64#.)-
t4NBSU1IPOFT
t.*1*$BNFSBBOE%JTQMBZ
t&YUFSOBM4UPSBHF
t)%.* %JTQMBZ1PSU 1.3, eSATA
t6MUSBCPPLT /PUFCPPLT
t4FU5PQ#PYFT (BNF Consoles
t)JHI4QFFE4FSJBM Interfaces
t5BCMFUT F3FBEFST
-JGF4VQQPSU/PUF Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated.
©2014 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 10/14/14
SP3022 Series 1 506
TVS Diode Arrays (SPA®® Diodes) Low Capacitance ESD Protection - SP3022 Series
Thermal Information
Absolute Maximum Ratings Symbol
Parameter
PPK
Value
Peak Pulse Power (tP=8/20μs)
IPP
Peak Current (tp=8/20μs)
TOP
Operating Temperature
Parameter
Rating
Units
-55 to 150
°C
Maximum Junction Temperature
150
°C
.BYJNVN-FBE5FNQFSBUVSF (Soldering 20-40s)
260
°C
Units
20
Storage Temperature Range
W
3.0
A
-40 to 125
°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
Electrical Characteristics (TOP=25ºC) Parameter
Symbol
Reverse Standoff Voltage
Test Conditions
Min
VRWM 1R=1mA
6.8
Reverse Breakdown Voltage
VBR
3FWFSTF-FBLBHF$VSSFOU
I-&",
VR=5.3V
VC
IPP=1A, tp T 'XE
Dynamic Resistance2
R%:/
5-1 UQ OT *0UP(/%
ESD Withstand Voltage1
VESD
Clamp Voltage1
Diode Capacitance
Typ
1
7.8
